JPS5651776A - Display unit - Google Patents

Display unit

Info

Publication number
JPS5651776A
JPS5651776A JP12687579A JP12687579A JPS5651776A JP S5651776 A JPS5651776 A JP S5651776A JP 12687579 A JP12687579 A JP 12687579A JP 12687579 A JP12687579 A JP 12687579A JP S5651776 A JPS5651776 A JP S5651776A
Authority
JP
Japan
Prior art keywords
display unit
display
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12687579A
Other languages
Japanese (ja)
Inventor
Osamu Ichikawa
Tetsuo Sadamasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP12687579A priority Critical patent/JPS5651776A/en
Publication of JPS5651776A publication Critical patent/JPS5651776A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP12687579A 1979-10-03 1979-10-03 Display unit Pending JPS5651776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12687579A JPS5651776A (en) 1979-10-03 1979-10-03 Display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12687579A JPS5651776A (en) 1979-10-03 1979-10-03 Display unit

Publications (1)

Publication Number Publication Date
JPS5651776A true JPS5651776A (en) 1981-05-09

Family

ID=14945999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12687579A Pending JPS5651776A (en) 1979-10-03 1979-10-03 Display unit

Country Status (1)

Country Link
JP (1) JPS5651776A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124052U (en) * 1984-01-30 1985-08-21 三洋電機株式会社 light emitting diode array head
JPS60233683A (en) * 1984-05-07 1985-11-20 双葉電子工業株式会社 Color fluorescent display unit
JPH01153656U (en) * 1988-04-05 1989-10-23
JP4932478B2 (en) * 2004-06-25 2012-05-16 三菱電機株式会社 Elevator equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124052U (en) * 1984-01-30 1985-08-21 三洋電機株式会社 light emitting diode array head
JPS60233683A (en) * 1984-05-07 1985-11-20 双葉電子工業株式会社 Color fluorescent display unit
JPH01153656U (en) * 1988-04-05 1989-10-23
JP4932478B2 (en) * 2004-06-25 2012-05-16 三菱電機株式会社 Elevator equipment

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