JPS5651776A - Display unit - Google Patents
Display unitInfo
- Publication number
- JPS5651776A JPS5651776A JP12687579A JP12687579A JPS5651776A JP S5651776 A JPS5651776 A JP S5651776A JP 12687579 A JP12687579 A JP 12687579A JP 12687579 A JP12687579 A JP 12687579A JP S5651776 A JPS5651776 A JP S5651776A
- Authority
- JP
- Japan
- Prior art keywords
- display unit
- display
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12687579A JPS5651776A (en) | 1979-10-03 | 1979-10-03 | Display unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12687579A JPS5651776A (en) | 1979-10-03 | 1979-10-03 | Display unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5651776A true JPS5651776A (en) | 1981-05-09 |
Family
ID=14945999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12687579A Pending JPS5651776A (en) | 1979-10-03 | 1979-10-03 | Display unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5651776A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60124052U (en) * | 1984-01-30 | 1985-08-21 | 三洋電機株式会社 | light emitting diode array head |
JPS60233683A (en) * | 1984-05-07 | 1985-11-20 | 双葉電子工業株式会社 | Color fluorescent display unit |
JPH01153656U (en) * | 1988-04-05 | 1989-10-23 | ||
JP4932478B2 (en) * | 2004-06-25 | 2012-05-16 | 三菱電機株式会社 | Elevator equipment |
-
1979
- 1979-10-03 JP JP12687579A patent/JPS5651776A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60124052U (en) * | 1984-01-30 | 1985-08-21 | 三洋電機株式会社 | light emitting diode array head |
JPS60233683A (en) * | 1984-05-07 | 1985-11-20 | 双葉電子工業株式会社 | Color fluorescent display unit |
JPH01153656U (en) * | 1988-04-05 | 1989-10-23 | ||
JP4932478B2 (en) * | 2004-06-25 | 2012-05-16 | 三菱電機株式会社 | Elevator equipment |
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