JPS5636196A - Apparatus for assembling electronic device circuit - Google Patents
Apparatus for assembling electronic device circuitInfo
- Publication number
- JPS5636196A JPS5636196A JP11259279A JP11259279A JPS5636196A JP S5636196 A JPS5636196 A JP S5636196A JP 11259279 A JP11259279 A JP 11259279A JP 11259279 A JP11259279 A JP 11259279A JP S5636196 A JPS5636196 A JP S5636196A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- device circuit
- assembling electronic
- assembling
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11259279A JPS5636196A (en) | 1979-09-03 | 1979-09-03 | Apparatus for assembling electronic device circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11259279A JPS5636196A (en) | 1979-09-03 | 1979-09-03 | Apparatus for assembling electronic device circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5636196A true JPS5636196A (en) | 1981-04-09 |
Family
ID=14590585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11259279A Pending JPS5636196A (en) | 1979-09-03 | 1979-09-03 | Apparatus for assembling electronic device circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5636196A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827393A (en) * | 1981-07-29 | 1983-02-18 | エヌ・ベー・フイリップス・フルーイランペンファブリケン | Method of positioning electric and/or electronic part on board and device therefor |
JPS58191494A (en) * | 1982-04-21 | 1983-11-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Part placing method and device |
JPS6171693A (en) * | 1984-09-17 | 1986-04-12 | ティーディーケイ株式会社 | Method of mounting chip part |
JPS61264788A (en) * | 1985-05-20 | 1986-11-22 | ティーディーケイ株式会社 | Chip part mounting machine |
JPH02291199A (en) * | 1989-04-28 | 1990-11-30 | Juki Corp | Chip component supply device |
JPH03257897A (en) * | 1990-03-07 | 1991-11-18 | Sony Corp | Mounting device for component |
JP2007201259A (en) * | 2006-01-27 | 2007-08-09 | Shinko Electric Ind Co Ltd | Method of manufacturing semiconductor device, and apparatus of mounting semiconductor device |
JP2015170800A (en) * | 2014-03-10 | 2015-09-28 | 富士機械製造株式会社 | Electronic component supply device |
WO2019103051A1 (en) * | 2017-11-21 | 2019-05-31 | 株式会社ハリーズ | Electronic component attaching device and method for manufacturing electronic device |
WO2020235535A1 (en) * | 2019-05-21 | 2020-11-26 | 株式会社ハリーズ | Electronic component attaching device, method for manufacturing electronic device, and method for manufacturing strap |
-
1979
- 1979-09-03 JP JP11259279A patent/JPS5636196A/en active Pending
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5827393A (en) * | 1981-07-29 | 1983-02-18 | エヌ・ベー・フイリップス・フルーイランペンファブリケン | Method of positioning electric and/or electronic part on board and device therefor |
JPH0345559B2 (en) * | 1981-07-29 | 1991-07-11 | Fuiritsupusu Furuuiranpenfuaburiken Nv | |
JPS58191494A (en) * | 1982-04-21 | 1983-11-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Part placing method and device |
JPS6171693A (en) * | 1984-09-17 | 1986-04-12 | ティーディーケイ株式会社 | Method of mounting chip part |
JPH0369200B2 (en) * | 1984-09-17 | 1991-10-31 | Tdk Electronics Co Ltd | |
JPS61264788A (en) * | 1985-05-20 | 1986-11-22 | ティーディーケイ株式会社 | Chip part mounting machine |
JPH0370920B2 (en) * | 1985-05-20 | 1991-11-11 | Tdk Electronics Co Ltd | |
JPH02291199A (en) * | 1989-04-28 | 1990-11-30 | Juki Corp | Chip component supply device |
JPH03257897A (en) * | 1990-03-07 | 1991-11-18 | Sony Corp | Mounting device for component |
JP2007201259A (en) * | 2006-01-27 | 2007-08-09 | Shinko Electric Ind Co Ltd | Method of manufacturing semiconductor device, and apparatus of mounting semiconductor device |
JP2015170800A (en) * | 2014-03-10 | 2015-09-28 | 富士機械製造株式会社 | Electronic component supply device |
WO2019103051A1 (en) * | 2017-11-21 | 2019-05-31 | 株式会社ハリーズ | Electronic component attaching device and method for manufacturing electronic device |
CN111434204A (en) * | 2017-11-21 | 2020-07-17 | 哈里斯股份有限公司 | Electronic component mounting device and method for manufacturing electronic device |
JPWO2019103051A1 (en) * | 2017-11-21 | 2020-12-17 | 株式会社 ハリーズ | Electronic component mounting device and manufacturing method of electronic device |
CN111434204B (en) * | 2017-11-21 | 2022-05-13 | 哈里斯股份有限公司 | Electronic component mounting device and method for manufacturing electronic device |
CN114786461A (en) * | 2017-11-21 | 2022-07-22 | 哈里斯股份有限公司 | Electronic component mounting device and method for manufacturing electronic device |
US11670526B2 (en) | 2017-11-21 | 2023-06-06 | Hallys Corporation | Electronic component mounting device for mounting electronic components |
WO2020235535A1 (en) * | 2019-05-21 | 2020-11-26 | 株式会社ハリーズ | Electronic component attaching device, method for manufacturing electronic device, and method for manufacturing strap |
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