JPS5633500A - Averaging apparatus of distribution of plating electric current - Google Patents
Averaging apparatus of distribution of plating electric currentInfo
- Publication number
- JPS5633500A JPS5633500A JP10858079A JP10858079A JPS5633500A JP S5633500 A JPS5633500 A JP S5633500A JP 10858079 A JP10858079 A JP 10858079A JP 10858079 A JP10858079 A JP 10858079A JP S5633500 A JPS5633500 A JP S5633500A
- Authority
- JP
- Japan
- Prior art keywords
- equipment
- constructed
- electric current
- board
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To make the thickness of plating metal uniform and to improve the quality, by providing perforated sheltering board having a hole area variable structure between electrodes and providing with the means, such as special sensor, central processing equipment etc., making an electric current density equal by operating said sheltering board.
CONSTITUTION: The perforations 8 are provided on the two slidable boards 7, 7' between the anode 1 and the cathode 2 and the perforated sheltering board 6 constructed as the hole area variable by the central processing equipment 5, is provided with said boards. The cathode 2 is connected with the equipment 5 by the sensor constructed by providing with the conductive body 3 which is divided in a minute area on the insulation substrate and also, the body 3 is connected with the equipment 5 through the leading wires 4. By said constructed equipment, an electric current charged on the body 3, is measured and operated by the equipment 5 and the signal is sent to the servomotor 9 and then, it is constructed so as to stop the motor 9 when the current is equalized by changing the hole area of the board 6. Thus, distribution of current density at the time of plating, is rapidly averaged and the thickness of plated metal is uniformalized.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10858079A JPS5633500A (en) | 1979-08-28 | 1979-08-28 | Averaging apparatus of distribution of plating electric current |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10858079A JPS5633500A (en) | 1979-08-28 | 1979-08-28 | Averaging apparatus of distribution of plating electric current |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5633500A true JPS5633500A (en) | 1981-04-03 |
Family
ID=14488410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10858079A Pending JPS5633500A (en) | 1979-08-28 | 1979-08-28 | Averaging apparatus of distribution of plating electric current |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5633500A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63176500A (en) * | 1987-01-16 | 1988-07-20 | Shinko Electric Ind Co Ltd | Shielding plate for electroplating |
JPH02145791A (en) * | 1988-11-28 | 1990-06-05 | Eagle Ind Co Ltd | Method and equipment for plating and shielding plate for plating |
JPH0444373U (en) * | 1990-08-15 | 1992-04-15 | ||
JP2010138433A (en) * | 2008-12-10 | 2010-06-24 | Renesas Electronics Corp | Apparatus and method for manufacturing semiconductor apparatus |
JP2013072139A (en) * | 2011-09-27 | 2013-04-22 | Samsung Electro-Mechanics Co Ltd | Plating shielding device and plating apparatus having the same |
JP2014129592A (en) * | 2012-12-27 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating shield board and electrolytic plating device possessing the same |
CN105420778A (en) * | 2007-12-04 | 2016-03-23 | 株式会社荏原制作所 | Plating apparatus and plating method |
JP2017115171A (en) * | 2015-12-21 | 2017-06-29 | 株式会社荏原製作所 | Regulation plate, plating system therewith and plating method |
JP2017137519A (en) * | 2016-02-01 | 2017-08-10 | 株式会社荏原製作所 | Plating device |
JP7204060B1 (en) * | 2022-05-27 | 2023-01-13 | 株式会社荏原製作所 | Resistor for plating equipment and plating equipment |
JP2023505619A (en) * | 2020-02-28 | 2023-02-09 | セムシスコ ゲーエムベーハー | Distribution system for process fluids for chemical and/or electrolytic surface treatment of substrates |
-
1979
- 1979-08-28 JP JP10858079A patent/JPS5633500A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63176500A (en) * | 1987-01-16 | 1988-07-20 | Shinko Electric Ind Co Ltd | Shielding plate for electroplating |
JPH02145791A (en) * | 1988-11-28 | 1990-06-05 | Eagle Ind Co Ltd | Method and equipment for plating and shielding plate for plating |
JPH0444373U (en) * | 1990-08-15 | 1992-04-15 | ||
CN105420778A (en) * | 2007-12-04 | 2016-03-23 | 株式会社荏原制作所 | Plating apparatus and plating method |
JP2010138433A (en) * | 2008-12-10 | 2010-06-24 | Renesas Electronics Corp | Apparatus and method for manufacturing semiconductor apparatus |
JP2013072139A (en) * | 2011-09-27 | 2013-04-22 | Samsung Electro-Mechanics Co Ltd | Plating shielding device and plating apparatus having the same |
KR101472637B1 (en) * | 2012-12-27 | 2014-12-15 | 삼성전기주식회사 | Electro Plating Cover Plate and Electro Plating Device having it |
JP2014129592A (en) * | 2012-12-27 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating shield board and electrolytic plating device possessing the same |
JP2017115171A (en) * | 2015-12-21 | 2017-06-29 | 株式会社荏原製作所 | Regulation plate, plating system therewith and plating method |
WO2017110432A1 (en) * | 2015-12-21 | 2017-06-29 | 株式会社荏原製作所 | Regulation plate, plating apparatus provided with same, and plating method |
KR20180090797A (en) * | 2015-12-21 | 2018-08-13 | 가부시키가이샤 에바라 세이사꾸쇼 | Regulating plate, plating apparatus having the same, and plating method |
JP2017137519A (en) * | 2016-02-01 | 2017-08-10 | 株式会社荏原製作所 | Plating device |
JP2023505619A (en) * | 2020-02-28 | 2023-02-09 | セムシスコ ゲーエムベーハー | Distribution system for process fluids for chemical and/or electrolytic surface treatment of substrates |
JP7204060B1 (en) * | 2022-05-27 | 2023-01-13 | 株式会社荏原製作所 | Resistor for plating equipment and plating equipment |
WO2023228398A1 (en) * | 2022-05-27 | 2023-11-30 | 株式会社荏原製作所 | Resistor for plating apparatuses, and plating apparatus |
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