JPS5633500A - Averaging apparatus of distribution of plating electric current - Google Patents

Averaging apparatus of distribution of plating electric current

Info

Publication number
JPS5633500A
JPS5633500A JP10858079A JP10858079A JPS5633500A JP S5633500 A JPS5633500 A JP S5633500A JP 10858079 A JP10858079 A JP 10858079A JP 10858079 A JP10858079 A JP 10858079A JP S5633500 A JPS5633500 A JP S5633500A
Authority
JP
Japan
Prior art keywords
equipment
constructed
electric current
board
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10858079A
Other languages
Japanese (ja)
Inventor
Masami Watanabe
Narimitsu Matsumoto
Hideo Hoshino
Kyuzo Mitsui
Kenji Yamamoto
Ayako Miyahara
Yukichi Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10858079A priority Critical patent/JPS5633500A/en
Publication of JPS5633500A publication Critical patent/JPS5633500A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To make the thickness of plating metal uniform and to improve the quality, by providing perforated sheltering board having a hole area variable structure between electrodes and providing with the means, such as special sensor, central processing equipment etc., making an electric current density equal by operating said sheltering board.
CONSTITUTION: The perforations 8 are provided on the two slidable boards 7, 7' between the anode 1 and the cathode 2 and the perforated sheltering board 6 constructed as the hole area variable by the central processing equipment 5, is provided with said boards. The cathode 2 is connected with the equipment 5 by the sensor constructed by providing with the conductive body 3 which is divided in a minute area on the insulation substrate and also, the body 3 is connected with the equipment 5 through the leading wires 4. By said constructed equipment, an electric current charged on the body 3, is measured and operated by the equipment 5 and the signal is sent to the servomotor 9 and then, it is constructed so as to stop the motor 9 when the current is equalized by changing the hole area of the board 6. Thus, distribution of current density at the time of plating, is rapidly averaged and the thickness of plated metal is uniformalized.
COPYRIGHT: (C)1981,JPO&Japio
JP10858079A 1979-08-28 1979-08-28 Averaging apparatus of distribution of plating electric current Pending JPS5633500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10858079A JPS5633500A (en) 1979-08-28 1979-08-28 Averaging apparatus of distribution of plating electric current

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10858079A JPS5633500A (en) 1979-08-28 1979-08-28 Averaging apparatus of distribution of plating electric current

Publications (1)

Publication Number Publication Date
JPS5633500A true JPS5633500A (en) 1981-04-03

Family

ID=14488410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10858079A Pending JPS5633500A (en) 1979-08-28 1979-08-28 Averaging apparatus of distribution of plating electric current

Country Status (1)

Country Link
JP (1) JPS5633500A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176500A (en) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd Shielding plate for electroplating
JPH02145791A (en) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd Method and equipment for plating and shielding plate for plating
JPH0444373U (en) * 1990-08-15 1992-04-15
JP2010138433A (en) * 2008-12-10 2010-06-24 Renesas Electronics Corp Apparatus and method for manufacturing semiconductor apparatus
JP2013072139A (en) * 2011-09-27 2013-04-22 Samsung Electro-Mechanics Co Ltd Plating shielding device and plating apparatus having the same
JP2014129592A (en) * 2012-12-27 2014-07-10 Samsung Electro-Mechanics Co Ltd Electrolytic plating shield board and electrolytic plating device possessing the same
CN105420778A (en) * 2007-12-04 2016-03-23 株式会社荏原制作所 Plating apparatus and plating method
JP2017115171A (en) * 2015-12-21 2017-06-29 株式会社荏原製作所 Regulation plate, plating system therewith and plating method
JP2017137519A (en) * 2016-02-01 2017-08-10 株式会社荏原製作所 Plating device
JP7204060B1 (en) * 2022-05-27 2023-01-13 株式会社荏原製作所 Resistor for plating equipment and plating equipment
JP2023505619A (en) * 2020-02-28 2023-02-09 セムシスコ ゲーエムベーハー Distribution system for process fluids for chemical and/or electrolytic surface treatment of substrates

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63176500A (en) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd Shielding plate for electroplating
JPH02145791A (en) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd Method and equipment for plating and shielding plate for plating
JPH0444373U (en) * 1990-08-15 1992-04-15
CN105420778A (en) * 2007-12-04 2016-03-23 株式会社荏原制作所 Plating apparatus and plating method
JP2010138433A (en) * 2008-12-10 2010-06-24 Renesas Electronics Corp Apparatus and method for manufacturing semiconductor apparatus
JP2013072139A (en) * 2011-09-27 2013-04-22 Samsung Electro-Mechanics Co Ltd Plating shielding device and plating apparatus having the same
KR101472637B1 (en) * 2012-12-27 2014-12-15 삼성전기주식회사 Electro Plating Cover Plate and Electro Plating Device having it
JP2014129592A (en) * 2012-12-27 2014-07-10 Samsung Electro-Mechanics Co Ltd Electrolytic plating shield board and electrolytic plating device possessing the same
JP2017115171A (en) * 2015-12-21 2017-06-29 株式会社荏原製作所 Regulation plate, plating system therewith and plating method
WO2017110432A1 (en) * 2015-12-21 2017-06-29 株式会社荏原製作所 Regulation plate, plating apparatus provided with same, and plating method
KR20180090797A (en) * 2015-12-21 2018-08-13 가부시키가이샤 에바라 세이사꾸쇼 Regulating plate, plating apparatus having the same, and plating method
JP2017137519A (en) * 2016-02-01 2017-08-10 株式会社荏原製作所 Plating device
JP2023505619A (en) * 2020-02-28 2023-02-09 セムシスコ ゲーエムベーハー Distribution system for process fluids for chemical and/or electrolytic surface treatment of substrates
JP7204060B1 (en) * 2022-05-27 2023-01-13 株式会社荏原製作所 Resistor for plating equipment and plating equipment
WO2023228398A1 (en) * 2022-05-27 2023-11-30 株式会社荏原製作所 Resistor for plating apparatuses, and plating apparatus

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