JPS5616552A - Synthetic resin composition having improved thermal cycling - Google Patents

Synthetic resin composition having improved thermal cycling

Info

Publication number
JPS5616552A
JPS5616552A JP9107279A JP9107279A JPS5616552A JP S5616552 A JPS5616552 A JP S5616552A JP 9107279 A JP9107279 A JP 9107279A JP 9107279 A JP9107279 A JP 9107279A JP S5616552 A JPS5616552 A JP S5616552A
Authority
JP
Japan
Prior art keywords
resin composition
synthetic resin
thermal cycling
improved thermal
silicon compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9107279A
Other languages
Japanese (ja)
Other versions
JPS6032658B2 (en
Inventor
Hajime Sakano
Mikio Kodama
Toshihiro Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumika Polycarbonate Ltd
Original Assignee
Sumika Polycarbonate Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumika Polycarbonate Ltd filed Critical Sumika Polycarbonate Ltd
Priority to JP9107279A priority Critical patent/JPS6032658B2/en
Publication of JPS5616552A publication Critical patent/JPS5616552A/en
Publication of JPS6032658B2 publication Critical patent/JPS6032658B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: The titled composition not required to make the thickness of deposition large, capable of forming an improved plating product through nickel plating requiring no copper deposition, obtained by adding an organic silicon compound to a blend of a polysulfone and an ABC resins.
CONSTITUTION: 100pts.wt. blend consisting of 100W5wt% polysulfone resin and 0W95wt% ABS resin is blended with 0.05W3.0pts.wt. organic silicon compound, for example, a polysiloxane shown by the formula (R1WR4 are lower alkyl or aryl; n is 1W3) having a viscosity of preferably 101W105CPS.
COPYRIGHT: (C)1981,JPO&Japio
JP9107279A 1979-07-18 1979-07-18 Synthetic resin composition with excellent heat cycle properties Expired JPS6032658B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9107279A JPS6032658B2 (en) 1979-07-18 1979-07-18 Synthetic resin composition with excellent heat cycle properties

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9107279A JPS6032658B2 (en) 1979-07-18 1979-07-18 Synthetic resin composition with excellent heat cycle properties

Publications (2)

Publication Number Publication Date
JPS5616552A true JPS5616552A (en) 1981-02-17
JPS6032658B2 JPS6032658B2 (en) 1985-07-29

Family

ID=14016291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9107279A Expired JPS6032658B2 (en) 1979-07-18 1979-07-18 Synthetic resin composition with excellent heat cycle properties

Country Status (1)

Country Link
JP (1) JPS6032658B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58125736A (en) * 1982-01-20 1983-07-26 Sanyo Kako Kk Delustered thermoplastic resin composition
EP2500381A1 (en) * 2011-03-16 2012-09-19 Siemens Medical Instruments Pte. Ltd. Hydrophobic ABS plastic material for housing
US10497823B2 (en) 2018-03-14 2019-12-03 Kabushiki Kaisha Toshiba Light receiving device and method of manufacturing light receiving device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58125736A (en) * 1982-01-20 1983-07-26 Sanyo Kako Kk Delustered thermoplastic resin composition
EP2500381A1 (en) * 2011-03-16 2012-09-19 Siemens Medical Instruments Pte. Ltd. Hydrophobic ABS plastic material for housing
US8611568B2 (en) 2011-03-16 2013-12-17 Siemens Medical Instruments Pte. Ltd. Hydrophobic ABS plastics material for casings
US10497823B2 (en) 2018-03-14 2019-12-03 Kabushiki Kaisha Toshiba Light receiving device and method of manufacturing light receiving device

Also Published As

Publication number Publication date
JPS6032658B2 (en) 1985-07-29

Similar Documents

Publication Publication Date Title
JPS5649754A (en) Thermosetting organopolysiloxane composition
JPS56103224A (en) Preparation of epoxy-modified silicone resin
JPS57125212A (en) Photo-polymerizable composition
JPS57131250A (en) Silicone resin composition
JPS5616552A (en) Synthetic resin composition having improved thermal cycling
JPS5358496A (en) Production of graphite substrate for oxidation resistant coating
JPS5329357A (en) Preparation of melamine resin compositions
KR970701186A (en) High temperature epoxy resins
JPS52121650A (en) Resin compositions having excellent flame retardancy
JPS5256869A (en) Production of semiconductor element
JPS5626939A (en) Resin composition having excellent heat cycle characteristic
JPS564647A (en) Heat-resistant resin composition
JPS5688462A (en) Thermosetting resin composition
JPS5236133A (en) Resin compositions for powder coating compounds
JPS52124179A (en) Thermo-sensitive wire
JPS5341397A (en) Thermosetting resin composition
JPS56129214A (en) Production of high-molecular compound
JPS5590554A (en) Silicone-epoxy resin composition
JPS57143351A (en) Thermoplastic resin composition
JPS5228532A (en) Coating compounds to form sand-walllike coatings
JPS5590553A (en) Silicone-modified epoxy resin composition
JPS56129215A (en) Production of high-molecular compound
JPS5434337A (en) Polybutadiene resin composition for impregnating and coating film capacitor
JPS5361638A (en) Flame-retardant resin composition
JPS535248A (en) Flame-retardant polycarbonate compositions