JPS56161356U - - Google Patents
Info
- Publication number
- JPS56161356U JPS56161356U JP5727180U JP5727180U JPS56161356U JP S56161356 U JPS56161356 U JP S56161356U JP 5727180 U JP5727180 U JP 5727180U JP 5727180 U JP5727180 U JP 5727180U JP S56161356 U JPS56161356 U JP S56161356U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5727180U JPS56161356U (ja) | 1980-04-28 | 1980-04-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5727180U JPS56161356U (ja) | 1980-04-28 | 1980-04-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56161356U true JPS56161356U (ja) | 1981-12-01 |
Family
ID=29651772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5727180U Pending JPS56161356U (ja) | 1980-04-28 | 1980-04-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56161356U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350049A (ja) * | 1986-08-19 | 1988-03-02 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
JPS63204753A (ja) * | 1987-02-20 | 1988-08-24 | Nitto Electric Ind Co Ltd | 半導体装置 |
-
1980
- 1980-04-28 JP JP5727180U patent/JPS56161356U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350049A (ja) * | 1986-08-19 | 1988-03-02 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
JPS63204753A (ja) * | 1987-02-20 | 1988-08-24 | Nitto Electric Ind Co Ltd | 半導体装置 |