JPS56160091A - Adhesive for printed circuit board - Google Patents

Adhesive for printed circuit board

Info

Publication number: JPS56160091A
Authority: JP; Japan
Prior art keywords: adhesive; circuit board; printed circuit; printed; board
Prior art date: 1980-04-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP5034080A

Other languages

Japanese (ja)

Other versions

JPS6146026B2 (en

Inventor

Kazumi Nagai

Chiaki Tanaka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toray Industries Inc

Original Assignee

Toray Industries Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-04-18

Filing date

1980-04-18

Publication date

1981-12-09

1980-04-18 Application filed by Toray Industries Inc filed Critical Toray Industries Inc

1980-04-18 Priority to JP5034080A priority Critical patent/JPS56160091A/en

1981-12-09 Publication of JPS56160091A publication Critical patent/JPS56160091A/en

1986-10-11 Publication of JPS6146026B2 publication Critical patent/JPS6146026B2/ja

Status Granted legal-status Critical Current

Links

Landscapes

Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Adhesives Or Adhesive Processes (AREA)
Manufacturing Of Printed Wiring (AREA)

JP5034080A 1980-04-18 1980-04-18 Adhesive for printed circuit board Granted JPS56160091A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP5034080A JPS56160091A (en)	1980-04-18	1980-04-18	Adhesive for printed circuit board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP5034080A JPS56160091A (en)	1980-04-18	1980-04-18	Adhesive for printed circuit board

Publications (2)

Publication Number	Publication Date
JPS56160091A true JPS56160091A (en)	1981-12-09
JPS6146026B2 JPS6146026B2 (en)	1986-10-11

Family

ID=12856184

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP5034080A Granted JPS56160091A (en)	1980-04-18	1980-04-18	Adhesive for printed circuit board

Country Status (1)

Country	Link
JP (1)	JPS56160091A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1996002592A1 (en) *	1994-07-18	1996-02-01	Toray Industries, Inc.	Epoxy resin composition, prepreg, and fiber-reinforced composite material
JP2001354938A (en) *	2000-06-12	2001-12-25	Toray Ind Inc	Adhesive composition for semiconductor device, and adhesive sheet prepared by using the composition, semiconductor-connecting substrate, and semiconductor device prepared by using the composition
JP2005008856A (en) *	2003-03-28	2005-01-13	M & S Kenkyu Kaihatsu Kk	Method for producing polymer compound from polyester and diamine, the polymer compound, and structure containing the polymer compound
JP2006152015A (en) *	2004-11-25	2006-06-15	Toyobo Co Ltd	Adhesive and flexible printed circuit board using the same

1980
- 1980-04-18 JP JP5034080A patent/JPS56160091A/en active Granted

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1996002592A1 (en) *	1994-07-18	1996-02-01	Toray Industries, Inc.	Epoxy resin composition, prepreg, and fiber-reinforced composite material
JP2001354938A (en) *	2000-06-12	2001-12-25	Toray Ind Inc	Adhesive composition for semiconductor device, and adhesive sheet prepared by using the composition, semiconductor-connecting substrate, and semiconductor device prepared by using the composition
JP2005008856A (en) *	2003-03-28	2005-01-13	M & S Kenkyu Kaihatsu Kk	Method for producing polymer compound from polyester and diamine, the polymer compound, and structure containing the polymer compound
JP2006152015A (en) *	2004-11-25	2006-06-15	Toyobo Co Ltd	Adhesive and flexible printed circuit board using the same
JP4645170B2 (en) *	2004-11-25	2011-03-09	東洋紡績株式会社	Adhesive and flexible printed circuit board using the same

Also Published As

Publication number	Publication date
JPS6146026B2 (en)	1986-10-11

Similar Documents

Publication	Publication Date	Title
JPS5790170A (en)	1982-06-04	Inspecter for printed circuit board
GB2080629B (en)	1983-09-01	Printed circuit boards
GB2080042B (en)	1983-12-21	Printed circuit board
GB2073957B (en)	1984-02-01	Printed circuit board
JPS56155587A (en)	1981-12-01	Printed circuit board
JPS5713791A (en)	1982-01-23	Printed circuit board
GB2087654B (en)	1984-04-26	Printed circuit boards
JPS56160091A (en)	1981-12-09	Adhesive for printed circuit board
JPS5776897A (en)	1982-05-14	Printed circuit board
ZA816271B (en)	1982-08-25	Printed circuit board
JPS5713674A (en)	1982-01-23	Printed circuit board
JPS575385A (en)	1982-01-12	Printed circuit board
JPS5750487A (en)	1982-03-24	Device for securing printed circuit board
JPS5796588A (en)	1982-06-15	Printed circuit board
JPS5743491A (en)	1982-03-11	Printed circuit board
JPS5785283A (en)	1982-05-27	Printed circuit board
JPS5789294A (en)	1982-06-03	Printed circuit board
JPS5718381A (en)	1982-01-30	Printed circuit board
JPS575387A (en)	1982-01-12	Printed circuit board
JPS5769795A (en)	1982-04-28	Printed circuit board
JPS56169397A (en)	1981-12-26	Printed circuit board
JPS5783086A (en)	1982-05-24	Printed circuit board
JPS5752193A (en)	1982-03-27	Printed circuit board
JPS56155585A (en)	1981-12-01	Printed circuit board
JPS5730397A (en)	1982-02-18	Printed circuit board