JPS56152250A - Multilayer wiring method - Google Patents
Multilayer wiring methodInfo
- Publication number
- JPS56152250A JPS56152250A JP5547180A JP5547180A JPS56152250A JP S56152250 A JPS56152250 A JP S56152250A JP 5547180 A JP5547180 A JP 5547180A JP 5547180 A JP5547180 A JP 5547180A JP S56152250 A JPS56152250 A JP S56152250A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- layer
- irradiated
- laser beam
- connecting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent the disconnection of a wire in a multilayer wiring structure using polycrystalline silicon layer by providing a connecting post at the connecting part of the wire of the first layer to the wire of the second layer, thereby eliminating the step produced at the connecting part. CONSTITUTION:A polycrystalline silicon layer 6 is formed by a sputtering method on a semiconductor substrate 1, a laser beam 7 is irradiated to the necessary part to provide conductivity, and the wire 8 of the first layer is thus formed. The layer 6 is again formed, a laser beam 7 is irradiated to the part 9 to be connected with the wire, and a connecting post is thus formed. Subsequently, a polycrystalline layer is, in order to form the wire of the second layer, formed, and the laser beam 7 is irradiated to the part to be formed with the wire. When this operation is repeated, a desired multilayer wire can be formed. Since no step is formed at the connecting part of the wires and the connecting part is flat, the multilayer wire having less disconnection can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5547180A JPS56152250A (en) | 1980-04-28 | 1980-04-28 | Multilayer wiring method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5547180A JPS56152250A (en) | 1980-04-28 | 1980-04-28 | Multilayer wiring method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56152250A true JPS56152250A (en) | 1981-11-25 |
Family
ID=12999512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5547180A Pending JPS56152250A (en) | 1980-04-28 | 1980-04-28 | Multilayer wiring method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152250A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931353A (en) * | 1989-03-01 | 1990-06-05 | The Boeing Company | Structure and method for selectively producing a conductive region on a substrate |
-
1980
- 1980-04-28 JP JP5547180A patent/JPS56152250A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931353A (en) * | 1989-03-01 | 1990-06-05 | The Boeing Company | Structure and method for selectively producing a conductive region on a substrate |
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