JPS56151730A - Heat curable resin composition - Google Patents

Heat curable resin composition

Info

Publication number
JPS56151730A
JPS56151730A JP5419080A JP5419080A JPS56151730A JP S56151730 A JPS56151730 A JP S56151730A JP 5419080 A JP5419080 A JP 5419080A JP 5419080 A JP5419080 A JP 5419080A JP S56151730 A JPS56151730 A JP S56151730A
Authority
JP
Japan
Prior art keywords
formula
anhydride
phenol
ethylenically unsaturated
imide compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5419080A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5419080A priority Critical patent/JPS56151730A/en
Publication of JPS56151730A publication Critical patent/JPS56151730A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain the titled composition, having improved storage stability of the material at room temperature, and capable of giving a cured article having improved moldability and heat resistance, by using a specific imide compound and phenol-formaldehyde novolak condensate as essential components.
CONSTITUTION: (A) 100pts.wt. Imide compound expressed by formula I [R1 is ethylenically unsaturated group; R2 is formula II (y is H, CH3, Cl, etc.) or formula III (z is H or CH3); m+n≤10] and/or formula IV [m+n+x≤10 (preferably m is 1W5; n is 1W5; x is 0W3)] is incorporated with (B) preferably 5W1,000pts.wt. phenol-formaldehyde novolak condensate to give the aimed composition. The component (A) is obtained by reacting an aniline-formaldehyde resin having a softening point ≤200°C with an ethylenically unsaturated dicrboxylic acid anhydride, e.g. maleic anhydride, and a carboxylic acid anhydride, e.g. tetrahydropthalic anhydride.
COPYRIGHT: (C)1981,JPO&Japio
JP5419080A 1980-04-25 1980-04-25 Heat curable resin composition Pending JPS56151730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5419080A JPS56151730A (en) 1980-04-25 1980-04-25 Heat curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5419080A JPS56151730A (en) 1980-04-25 1980-04-25 Heat curable resin composition

Publications (1)

Publication Number Publication Date
JPS56151730A true JPS56151730A (en) 1981-11-24

Family

ID=12963616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5419080A Pending JPS56151730A (en) 1980-04-25 1980-04-25 Heat curable resin composition

Country Status (1)

Country Link
JP (1) JPS56151730A (en)

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