JPS56147458A - Semiconductor converter - Google Patents
Semiconductor converterInfo
- Publication number
- JPS56147458A JPS56147458A JP5044880A JP5044880A JPS56147458A JP S56147458 A JPS56147458 A JP S56147458A JP 5044880 A JP5044880 A JP 5044880A JP 5044880 A JP5044880 A JP 5044880A JP S56147458 A JPS56147458 A JP S56147458A
- Authority
- JP
- Japan
- Prior art keywords
- stages
- cooling
- temperature
- piled
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To restrain the rise in temperature of the central stages of piled cooling bodies and obtain a semiconductor converter of excellent cooling performance by making the projecting length of the heat-shielding plates in the central stages longer than that of those in both end stages. CONSTITUTION:Because the projecting length of heat-shielding plates 26 and 27, on the semiconductor-mounting side, is made longer than that of the others, air streams C and D passing through cooling bodies 15 and 16 include larger amounts of cold air, and also the effect of the rise in temperature resulting from the radiation by respective lower stages is avoided. Moreover, owing to a baffle plate 35, it is made difficult for the cold air flowing in from a ventilating hole 37 to flow through the cubicle central portion. By said constitution, the cooling temperature in each stage of the piled cooling bodies is uniformed, so that excellent cooling performance can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5044880A JPS56147458A (en) | 1980-04-18 | 1980-04-18 | Semiconductor converter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5044880A JPS56147458A (en) | 1980-04-18 | 1980-04-18 | Semiconductor converter |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56147458A true JPS56147458A (en) | 1981-11-16 |
Family
ID=12859139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5044880A Pending JPS56147458A (en) | 1980-04-18 | 1980-04-18 | Semiconductor converter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56147458A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030922A (en) * | 1983-08-01 | 1985-02-16 | Nippon Telegr & Teleph Corp <Ntt> | Air conditioner for electronic device |
JPS619890U (en) * | 1984-06-20 | 1986-01-21 | 株式会社 三社電機製作所 | Air-cooled electrical equipment |
US4644443A (en) * | 1985-09-27 | 1987-02-17 | Texas Instruments Incorporated | Computer cooling system using recycled coolant |
US6704198B2 (en) * | 2002-06-12 | 2004-03-09 | Avava Technology Corp. | Equipment enclosure with heat exchanger |
US7085133B2 (en) * | 2003-07-09 | 2006-08-01 | International Business Machines Corporation | Cooling using complimentary tapered plenums |
US7236362B2 (en) * | 2004-11-18 | 2007-06-26 | Ncr Corporation | Minimization of cooling air preheat for maximum packaging density |
-
1980
- 1980-04-18 JP JP5044880A patent/JPS56147458A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6030922A (en) * | 1983-08-01 | 1985-02-16 | Nippon Telegr & Teleph Corp <Ntt> | Air conditioner for electronic device |
JPS619890U (en) * | 1984-06-20 | 1986-01-21 | 株式会社 三社電機製作所 | Air-cooled electrical equipment |
US4644443A (en) * | 1985-09-27 | 1987-02-17 | Texas Instruments Incorporated | Computer cooling system using recycled coolant |
US6704198B2 (en) * | 2002-06-12 | 2004-03-09 | Avava Technology Corp. | Equipment enclosure with heat exchanger |
US7085133B2 (en) * | 2003-07-09 | 2006-08-01 | International Business Machines Corporation | Cooling using complimentary tapered plenums |
US7236362B2 (en) * | 2004-11-18 | 2007-06-26 | Ncr Corporation | Minimization of cooling air preheat for maximum packaging density |
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