JPS56146667A - Mirror surface grinder - Google Patents

Mirror surface grinder

Info

Publication number
JPS56146667A
JPS56146667A JP5038080A JP5038080A JPS56146667A JP S56146667 A JPS56146667 A JP S56146667A JP 5038080 A JP5038080 A JP 5038080A JP 5038080 A JP5038080 A JP 5038080A JP S56146667 A JPS56146667 A JP S56146667A
Authority
JP
Japan
Prior art keywords
binder
holding pad
grinding
grooves
mirror surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5038080A
Other languages
Japanese (ja)
Other versions
JPS6365473B2 (en
Inventor
Masaru Tsukahara
Hideo Shibuya
Michio Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5038080A priority Critical patent/JPS56146667A/en
Publication of JPS56146667A publication Critical patent/JPS56146667A/en
Publication of JPS6365473B2 publication Critical patent/JPS6365473B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve flatness by grinding the mirror surface and to extend life of a holding pad by providing a multitude of depressions on the surface of a pushing plate to gule a holding pad through binder. CONSTITUTION:Guides 9 are embedded in free command of getting in and out through springs 12 on the pushing surface 10 of the lower face of a pushing plate 3 which faces opposite to a rotary disc 4. And four grooves (depressions) 15 are provided in concentric circles on the pushing surface 10 which is surrounded by the guides 9, and it is glued through binder (adhesive) 14 which does not harden a wafer holding pad 13 to the part of the surface 10 having these grooves 15. In result, the binder 14 does not make lopsidedness because even with frictional force at the time of grinding, the binder 14 is thin, and part of the binder 14 gets into the grooves 15 resulting in being hardly moved. Thus, this facilitates to improve flatness of the work to be ground by grinding the mirror surface, and to extend life of the holding pad.
JP5038080A 1980-04-18 1980-04-18 Mirror surface grinder Granted JPS56146667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5038080A JPS56146667A (en) 1980-04-18 1980-04-18 Mirror surface grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5038080A JPS56146667A (en) 1980-04-18 1980-04-18 Mirror surface grinder

Publications (2)

Publication Number Publication Date
JPS56146667A true JPS56146667A (en) 1981-11-14
JPS6365473B2 JPS6365473B2 (en) 1988-12-15

Family

ID=12857261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5038080A Granted JPS56146667A (en) 1980-04-18 1980-04-18 Mirror surface grinder

Country Status (1)

Country Link
JP (1) JPS56146667A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959347A (en) * 1982-09-23 1984-04-05 ウイリアム・デイ−・ブデインガ− Work holder for operation of grinding
JPS60118467A (en) * 1983-11-30 1985-06-25 Fujimi Kenmazai Kogyo Kk Semi-conductor wafer attaching method
JPH0679618A (en) * 1991-12-20 1994-03-22 Cybeq Syst Inc Method and device for using edge retainer of polishing head
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
JP2009255292A (en) * 1994-03-02 2009-11-05 Applied Materials Inc Carrier head and system for chemical mechanical polishing of substrate
JP2011201015A (en) * 1995-10-09 2011-10-13 Ebara Corp Apparatus and method for polishing
CN103419122A (en) * 2013-08-13 2013-12-04 国家电网公司 Thrust runner collar grinding platform

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458294A (en) * 1977-10-19 1979-05-10 Hitachi Ltd Waxless polishing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458294A (en) * 1977-10-19 1979-05-10 Hitachi Ltd Waxless polishing device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0335063B2 (en) * 1982-09-23 1991-05-24 Deii Budeingaa Uiriamu
JPS5959347A (en) * 1982-09-23 1984-04-05 ウイリアム・デイ−・ブデインガ− Work holder for operation of grinding
JPS60118467A (en) * 1983-11-30 1985-06-25 Fujimi Kenmazai Kogyo Kk Semi-conductor wafer attaching method
JPH0679618A (en) * 1991-12-20 1994-03-22 Cybeq Syst Inc Method and device for using edge retainer of polishing head
JP2597449B2 (en) * 1991-12-20 1997-04-09 サイベック・システムズ How to use polishing head and retainer
JP2009255292A (en) * 1994-03-02 2009-11-05 Applied Materials Inc Carrier head and system for chemical mechanical polishing of substrate
JP2011201015A (en) * 1995-10-09 2011-10-13 Ebara Corp Apparatus and method for polishing
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US7029382B2 (en) 1999-03-03 2006-04-18 Ebara Corporation Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US7311586B2 (en) 1999-03-03 2007-12-25 Ebara Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6309290B1 (en) 1999-03-03 2001-10-30 Mitsubishi Materials Corporation Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
CN103419122A (en) * 2013-08-13 2013-12-04 国家电网公司 Thrust runner collar grinding platform

Also Published As

Publication number Publication date
JPS6365473B2 (en) 1988-12-15

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