JPS56146667A - Mirror surface grinder - Google Patents
Mirror surface grinderInfo
- Publication number
- JPS56146667A JPS56146667A JP5038080A JP5038080A JPS56146667A JP S56146667 A JPS56146667 A JP S56146667A JP 5038080 A JP5038080 A JP 5038080A JP 5038080 A JP5038080 A JP 5038080A JP S56146667 A JPS56146667 A JP S56146667A
- Authority
- JP
- Japan
- Prior art keywords
- binder
- holding pad
- grinding
- grooves
- mirror surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To improve flatness by grinding the mirror surface and to extend life of a holding pad by providing a multitude of depressions on the surface of a pushing plate to gule a holding pad through binder. CONSTITUTION:Guides 9 are embedded in free command of getting in and out through springs 12 on the pushing surface 10 of the lower face of a pushing plate 3 which faces opposite to a rotary disc 4. And four grooves (depressions) 15 are provided in concentric circles on the pushing surface 10 which is surrounded by the guides 9, and it is glued through binder (adhesive) 14 which does not harden a wafer holding pad 13 to the part of the surface 10 having these grooves 15. In result, the binder 14 does not make lopsidedness because even with frictional force at the time of grinding, the binder 14 is thin, and part of the binder 14 gets into the grooves 15 resulting in being hardly moved. Thus, this facilitates to improve flatness of the work to be ground by grinding the mirror surface, and to extend life of the holding pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5038080A JPS56146667A (en) | 1980-04-18 | 1980-04-18 | Mirror surface grinder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5038080A JPS56146667A (en) | 1980-04-18 | 1980-04-18 | Mirror surface grinder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56146667A true JPS56146667A (en) | 1981-11-14 |
JPS6365473B2 JPS6365473B2 (en) | 1988-12-15 |
Family
ID=12857261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5038080A Granted JPS56146667A (en) | 1980-04-18 | 1980-04-18 | Mirror surface grinder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56146667A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5959347A (en) * | 1982-09-23 | 1984-04-05 | ウイリアム・デイ−・ブデインガ− | Work holder for operation of grinding |
JPS60118467A (en) * | 1983-11-30 | 1985-06-25 | Fujimi Kenmazai Kogyo Kk | Semi-conductor wafer attaching method |
JPH0679618A (en) * | 1991-12-20 | 1994-03-22 | Cybeq Syst Inc | Method and device for using edge retainer of polishing head |
US5876273A (en) * | 1996-04-01 | 1999-03-02 | Kabushiki Kaisha Toshiba | Apparatus for polishing a wafer |
US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
JP2009255292A (en) * | 1994-03-02 | 2009-11-05 | Applied Materials Inc | Carrier head and system for chemical mechanical polishing of substrate |
JP2011201015A (en) * | 1995-10-09 | 2011-10-13 | Ebara Corp | Apparatus and method for polishing |
CN103419122A (en) * | 2013-08-13 | 2013-12-04 | 国家电网公司 | Thrust runner collar grinding platform |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5458294A (en) * | 1977-10-19 | 1979-05-10 | Hitachi Ltd | Waxless polishing device |
-
1980
- 1980-04-18 JP JP5038080A patent/JPS56146667A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5458294A (en) * | 1977-10-19 | 1979-05-10 | Hitachi Ltd | Waxless polishing device |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0335063B2 (en) * | 1982-09-23 | 1991-05-24 | Deii Budeingaa Uiriamu | |
JPS5959347A (en) * | 1982-09-23 | 1984-04-05 | ウイリアム・デイ−・ブデインガ− | Work holder for operation of grinding |
JPS60118467A (en) * | 1983-11-30 | 1985-06-25 | Fujimi Kenmazai Kogyo Kk | Semi-conductor wafer attaching method |
JPH0679618A (en) * | 1991-12-20 | 1994-03-22 | Cybeq Syst Inc | Method and device for using edge retainer of polishing head |
JP2597449B2 (en) * | 1991-12-20 | 1997-04-09 | サイベック・システムズ | How to use polishing head and retainer |
JP2009255292A (en) * | 1994-03-02 | 2009-11-05 | Applied Materials Inc | Carrier head and system for chemical mechanical polishing of substrate |
JP2011201015A (en) * | 1995-10-09 | 2011-10-13 | Ebara Corp | Apparatus and method for polishing |
US5876273A (en) * | 1996-04-01 | 1999-03-02 | Kabushiki Kaisha Toshiba | Apparatus for polishing a wafer |
US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US7029382B2 (en) | 1999-03-03 | 2006-04-18 | Ebara Corporation | Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US7311586B2 (en) | 1999-03-03 | 2007-12-25 | Ebara Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6309290B1 (en) | 1999-03-03 | 2001-10-30 | Mitsubishi Materials Corporation | Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
CN103419122A (en) * | 2013-08-13 | 2013-12-04 | 国家电网公司 | Thrust runner collar grinding platform |
Also Published As
Publication number | Publication date |
---|---|
JPS6365473B2 (en) | 1988-12-15 |
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