JPS56135949A - Cooling device by boiling - Google Patents

Cooling device by boiling

Info

Publication number
JPS56135949A
JPS56135949A JP3890480A JP3890480A JPS56135949A JP S56135949 A JPS56135949 A JP S56135949A JP 3890480 A JP3890480 A JP 3890480A JP 3890480 A JP3890480 A JP 3890480A JP S56135949 A JPS56135949 A JP S56135949A
Authority
JP
Japan
Prior art keywords
refrigerant
liquid
heating body
vapor
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3890480A
Other languages
Japanese (ja)
Inventor
Teigo Okada
Hisao Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3890480A priority Critical patent/JPS56135949A/en
Publication of JPS56135949A publication Critical patent/JPS56135949A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform stable cooling by providing a refrigerant gas sensor and a detection indicator between a liquid reservoir and a suction-discharge pipe to prevent flow-out of the refrigerant from the liquid reservoir due to overheat of a heating body, etc. in a device wherein cooling is conducted by liquefying heated refrigerant vapor through condensation. CONSTITUTION:When the temperature starts to rise with the heating body 9 such as a semiconductor element and an electronic apparatus heating, refrigerant vapor 7c is generated from refrigerant liquid 7a, goes into a condenser 3 through a vapor pipe 2 and is liquefied through the inside of the condensor the condenser, and refrigerant liquid 7d returns to an evaporator 1 through a return pipe 4. The heating body 9 is cooled through this circulation. When the heating body is overheated and the vapor penetrates into the liquid reservoir 6 through a connecting pipe 5, sealing by the liquid 8 turns impossible, whereby the liquid flows out to the suction-discharge pipe 10. This is detected by the refrigerant gas sensor 11 and the detection indicator 12 provided between the reservoir and the suction-discharge pipe and a signal is sent therefrom, whereby heating of the heating body is stopped. By this constitution, the cooling device by boiling having a stable cooling performance can be obtained.
JP3890480A 1980-03-28 1980-03-28 Cooling device by boiling Pending JPS56135949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3890480A JPS56135949A (en) 1980-03-28 1980-03-28 Cooling device by boiling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3890480A JPS56135949A (en) 1980-03-28 1980-03-28 Cooling device by boiling

Publications (1)

Publication Number Publication Date
JPS56135949A true JPS56135949A (en) 1981-10-23

Family

ID=12538175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3890480A Pending JPS56135949A (en) 1980-03-28 1980-03-28 Cooling device by boiling

Country Status (1)

Country Link
JP (1) JPS56135949A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016164478A (en) * 2015-03-06 2016-09-08 株式会社東芝 Cooling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016164478A (en) * 2015-03-06 2016-09-08 株式会社東芝 Cooling device

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