JPS56135948A - Insulated radiating substrate - Google Patents

Insulated radiating substrate

Info

Publication number
JPS56135948A
JPS56135948A JP3978880A JP3978880A JPS56135948A JP S56135948 A JPS56135948 A JP S56135948A JP 3978880 A JP3978880 A JP 3978880A JP 3978880 A JP3978880 A JP 3978880A JP S56135948 A JPS56135948 A JP S56135948A
Authority
JP
Japan
Prior art keywords
radiating substrate
insulated radiating
metal
insulated
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3978880A
Other languages
Japanese (ja)
Inventor
Masashi Hasegawa
Masahiko Nakajima
Masaji Ishii
Shinsei Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP3978880A priority Critical patent/JPS56135948A/en
Publication of JPS56135948A publication Critical patent/JPS56135948A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To manufacture the insulated radiating substrate having large weld strength and heat conductivity by providing a metal coating through linear explosive flame spraying of metal or alloy on to the substrate whose main constituent is aluminum nitride. CONSTITUTION:After aluminum nitride to which aluminum oxide is added is formed into a thin plate, the linear explosive flame spraying is repeated by using a metal wire such as a wire of Mo, W, Ni, Mo-Mn alloy as a melting agent and thereby the insulated radiating substrate whereon the metal coating is applied is prepared. By this method, the insulated radiating substrate having a metallized layer with large welding strength and being excellent in heat conductivity can be obtained.
JP3978880A 1980-03-28 1980-03-28 Insulated radiating substrate Pending JPS56135948A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3978880A JPS56135948A (en) 1980-03-28 1980-03-28 Insulated radiating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3978880A JPS56135948A (en) 1980-03-28 1980-03-28 Insulated radiating substrate

Publications (1)

Publication Number Publication Date
JPS56135948A true JPS56135948A (en) 1981-10-23

Family

ID=12562674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3978880A Pending JPS56135948A (en) 1980-03-28 1980-03-28 Insulated radiating substrate

Country Status (1)

Country Link
JP (1) JPS56135948A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119051A (en) * 1984-11-15 1986-06-06 Nec Corp Semiconductor device
JPS61147558A (en) * 1984-12-21 1986-07-05 Toshiba Corp Semiconductor housing case
JPH01123352U (en) * 1988-02-15 1989-08-22
FR2638934A1 (en) * 1988-06-22 1990-05-11 Splintex Sa GLASS SUBSTRATE CARRYING AN ELECTRICAL CIRCUIT, ESPECIALLY HEATED GLAZING, AND METHOD OF MANUFACTURING THE SAME
JPH05243428A (en) * 1991-12-20 1993-09-21 Toshiba Corp Electronic equipment
US5293509A (en) * 1988-05-16 1994-03-08 Sumitomo Electric Industries, Ltd. Sintered body of aluminum nitride

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119051A (en) * 1984-11-15 1986-06-06 Nec Corp Semiconductor device
JPS61147558A (en) * 1984-12-21 1986-07-05 Toshiba Corp Semiconductor housing case
JPH01123352U (en) * 1988-02-15 1989-08-22
US5293509A (en) * 1988-05-16 1994-03-08 Sumitomo Electric Industries, Ltd. Sintered body of aluminum nitride
FR2638934A1 (en) * 1988-06-22 1990-05-11 Splintex Sa GLASS SUBSTRATE CARRYING AN ELECTRICAL CIRCUIT, ESPECIALLY HEATED GLAZING, AND METHOD OF MANUFACTURING THE SAME
BE1004164A3 (en) * 1988-06-22 1992-10-06 Splintex Belge Sa Glass substrate bearing an electric circuit and manufacturing method.
JPH05243428A (en) * 1991-12-20 1993-09-21 Toshiba Corp Electronic equipment

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