JPS56129114A - Method of cutting monocrystal - Google Patents
Method of cutting monocrystalInfo
- Publication number
- JPS56129114A JPS56129114A JP3264080A JP3264080A JPS56129114A JP S56129114 A JPS56129114 A JP S56129114A JP 3264080 A JP3264080 A JP 3264080A JP 3264080 A JP3264080 A JP 3264080A JP S56129114 A JPS56129114 A JP S56129114A
- Authority
- JP
- Japan
- Prior art keywords
- monocrystal
- cutting
- cutting monocrystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3264080A JPS56129114A (en) | 1980-03-17 | 1980-03-17 | Method of cutting monocrystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3264080A JPS56129114A (en) | 1980-03-17 | 1980-03-17 | Method of cutting monocrystal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56129114A true JPS56129114A (en) | 1981-10-09 |
JPH0115363B2 JPH0115363B2 (en) | 1989-03-16 |
Family
ID=12364441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3264080A Granted JPS56129114A (en) | 1980-03-17 | 1980-03-17 | Method of cutting monocrystal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56129114A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61283508A (en) * | 1985-06-11 | 1986-12-13 | 日立電線株式会社 | Method of slicing semiconductor crystal ingot |
JPH01171753A (en) * | 1987-12-26 | 1989-07-06 | Takatori Haitetsuku:Kk | Wire saw |
JPH09262825A (en) * | 1996-03-29 | 1997-10-07 | Shin Etsu Handotai Co Ltd | Method of slicing semiconductor single crystal ingot |
JP2004512251A (en) * | 2000-10-20 | 2004-04-22 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | METHOD AND APPARATUS FOR CUTTING SINGLE CRYSTAL AND CONTROL DEVICE AND TEST METHOD FOR DETERMINING CRYSTAL ORIENTATION |
-
1980
- 1980-03-17 JP JP3264080A patent/JPS56129114A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61283508A (en) * | 1985-06-11 | 1986-12-13 | 日立電線株式会社 | Method of slicing semiconductor crystal ingot |
JPH01171753A (en) * | 1987-12-26 | 1989-07-06 | Takatori Haitetsuku:Kk | Wire saw |
JPH09262825A (en) * | 1996-03-29 | 1997-10-07 | Shin Etsu Handotai Co Ltd | Method of slicing semiconductor single crystal ingot |
JP2004512251A (en) * | 2000-10-20 | 2004-04-22 | フライベルガー・コンパウンド・マテリアルズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | METHOD AND APPARATUS FOR CUTTING SINGLE CRYSTAL AND CONTROL DEVICE AND TEST METHOD FOR DETERMINING CRYSTAL ORIENTATION |
Also Published As
Publication number | Publication date |
---|---|
JPH0115363B2 (en) | 1989-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2085765B (en) | Cutting device and method of manufacture | |
DE3571212D1 (en) | Method of cutting | |
JPS5741192A (en) | Cutting method and cutter | |
ZA829140B (en) | Method of open cut mining | |
JPS56129114A (en) | Method of cutting monocrystal | |
JPS56119393A (en) | Cutting method | |
IL64598A0 (en) | Method of cutting narrow grooves | |
GB2135621B (en) | Method of cutting flexible materials | |
JPS5784900A (en) | Method of cutting envelope | |
JPS57107797A (en) | Method of cutting work | |
JPS54137358A (en) | Method of cutting glass | |
JPS57107795A (en) | Method of cutting log | |
JPS5784899A (en) | Method of cutting envelope | |
JPS57173116A (en) | Method of cutting stone | |
JPS5649206A (en) | Method of cutting monocrystal | |
JPS57204841A (en) | Method of cutting bundling string | |
JPS57107800A (en) | Method of cutting hard board | |
JPS5783397A (en) | Method of cutting amorphous metal | |
JPS57100023A (en) | Method of cutting hard material | |
JPS5796800A (en) | Method of cutting large number of shape | |
JPS57138599A (en) | Method of cutting form | |
JPS5796798A (en) | Method of cutting substrate | |
JPS56119400A (en) | Method of cutting thinnpiece substrate | |
JPS56137911A (en) | Method of cutting inorganic composition | |
IL64391A0 (en) | Method of cutting diamonds |