JPS5612734A - Wafer polishing method - Google Patents

Wafer polishing method

Info

Publication number
JPS5612734A
JPS5612734A JP8703779A JP8703779A JPS5612734A JP S5612734 A JPS5612734 A JP S5612734A JP 8703779 A JP8703779 A JP 8703779A JP 8703779 A JP8703779 A JP 8703779A JP S5612734 A JPS5612734 A JP S5612734A
Authority
JP
Japan
Prior art keywords
polishing
cloth
wafer
cloths
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8703779A
Other languages
Japanese (ja)
Inventor
Tsuneo Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8703779A priority Critical patent/JPS5612734A/en
Publication of JPS5612734A publication Critical patent/JPS5612734A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To accomplish the removal of fine defects on the surface and the giving of strains to the back simultaneously through a double-side polshing by separately polishing the surface and the back of the wafer with cloths different in kind. CONSTITUTION:The polishing cloth 4 is made up of a suedelike resin layer as a smooth cloth 0.2-0.5mm. thick with the distance between the openings ranging 10-50mu. On the other hand, the polishing cloth 5 is a surface-coarse unwoven cloth made of a fabric with a density 0.3-0.4g/cm<3>, for example. These two sheets of polishing cloths are set on the carrier 6 in such a manner that the polishing cloth 4 polishes the surface of the wafer 3 and the polishing cloth 5 the back thereof. Then, the carrier 6 is moved in the direction of the arrow with the movement of the wafer 3 in the same direction between the polishing cloths to perform polishing.
JP8703779A 1979-07-10 1979-07-10 Wafer polishing method Pending JPS5612734A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8703779A JPS5612734A (en) 1979-07-10 1979-07-10 Wafer polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8703779A JPS5612734A (en) 1979-07-10 1979-07-10 Wafer polishing method

Publications (1)

Publication Number Publication Date
JPS5612734A true JPS5612734A (en) 1981-02-07

Family

ID=13903742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8703779A Pending JPS5612734A (en) 1979-07-10 1979-07-10 Wafer polishing method

Country Status (1)

Country Link
JP (1) JPS5612734A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5899536U (en) * 1981-12-26 1983-07-06 倉敷化工株式会社 rubber butt
JPS6099339U (en) * 1983-12-12 1985-07-06 東海ゴム工業株式会社 Anti-vibration rubber bushing
JPS61173837U (en) * 1985-04-18 1986-10-29
JPH02142527U (en) * 1989-04-29 1990-12-04
JPH07164307A (en) * 1993-12-14 1995-06-27 Shin Etsu Handotai Co Ltd Polishing member and wafer polishing device
US7589023B2 (en) 2000-04-24 2009-09-15 Sumitomo Mitsubishi Silicon Corporation Method of manufacturing semiconductor wafer

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5899536U (en) * 1981-12-26 1983-07-06 倉敷化工株式会社 rubber butt
JPS6099339U (en) * 1983-12-12 1985-07-06 東海ゴム工業株式会社 Anti-vibration rubber bushing
JPS6337540Y2 (en) * 1983-12-12 1988-10-04
JPS61173837U (en) * 1985-04-18 1986-10-29
JPH02142527U (en) * 1989-04-29 1990-12-04
JPH07164307A (en) * 1993-12-14 1995-06-27 Shin Etsu Handotai Co Ltd Polishing member and wafer polishing device
US7589023B2 (en) 2000-04-24 2009-09-15 Sumitomo Mitsubishi Silicon Corporation Method of manufacturing semiconductor wafer
DE10196115B4 (en) * 2000-04-24 2011-06-16 Sumitomo Mitsubishi Silicon Corp. Method for polishing a semiconductor wafer
US8283252B2 (en) 2000-04-24 2012-10-09 Sumitomo Mitsubishi Silicon Corporation Method of manufacturing semiconductor wafer

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