JPS5612734A - Wafer polishing method - Google Patents
Wafer polishing methodInfo
- Publication number
- JPS5612734A JPS5612734A JP8703779A JP8703779A JPS5612734A JP S5612734 A JPS5612734 A JP S5612734A JP 8703779 A JP8703779 A JP 8703779A JP 8703779 A JP8703779 A JP 8703779A JP S5612734 A JPS5612734 A JP S5612734A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- cloth
- wafer
- cloths
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To accomplish the removal of fine defects on the surface and the giving of strains to the back simultaneously through a double-side polshing by separately polishing the surface and the back of the wafer with cloths different in kind. CONSTITUTION:The polishing cloth 4 is made up of a suedelike resin layer as a smooth cloth 0.2-0.5mm. thick with the distance between the openings ranging 10-50mu. On the other hand, the polishing cloth 5 is a surface-coarse unwoven cloth made of a fabric with a density 0.3-0.4g/cm<3>, for example. These two sheets of polishing cloths are set on the carrier 6 in such a manner that the polishing cloth 4 polishes the surface of the wafer 3 and the polishing cloth 5 the back thereof. Then, the carrier 6 is moved in the direction of the arrow with the movement of the wafer 3 in the same direction between the polishing cloths to perform polishing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8703779A JPS5612734A (en) | 1979-07-10 | 1979-07-10 | Wafer polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8703779A JPS5612734A (en) | 1979-07-10 | 1979-07-10 | Wafer polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5612734A true JPS5612734A (en) | 1981-02-07 |
Family
ID=13903742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8703779A Pending JPS5612734A (en) | 1979-07-10 | 1979-07-10 | Wafer polishing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5612734A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5899536U (en) * | 1981-12-26 | 1983-07-06 | 倉敷化工株式会社 | rubber butt |
JPS6099339U (en) * | 1983-12-12 | 1985-07-06 | 東海ゴム工業株式会社 | Anti-vibration rubber bushing |
JPS61173837U (en) * | 1985-04-18 | 1986-10-29 | ||
JPH02142527U (en) * | 1989-04-29 | 1990-12-04 | ||
JPH07164307A (en) * | 1993-12-14 | 1995-06-27 | Shin Etsu Handotai Co Ltd | Polishing member and wafer polishing device |
US7589023B2 (en) | 2000-04-24 | 2009-09-15 | Sumitomo Mitsubishi Silicon Corporation | Method of manufacturing semiconductor wafer |
-
1979
- 1979-07-10 JP JP8703779A patent/JPS5612734A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5899536U (en) * | 1981-12-26 | 1983-07-06 | 倉敷化工株式会社 | rubber butt |
JPS6099339U (en) * | 1983-12-12 | 1985-07-06 | 東海ゴム工業株式会社 | Anti-vibration rubber bushing |
JPS6337540Y2 (en) * | 1983-12-12 | 1988-10-04 | ||
JPS61173837U (en) * | 1985-04-18 | 1986-10-29 | ||
JPH02142527U (en) * | 1989-04-29 | 1990-12-04 | ||
JPH07164307A (en) * | 1993-12-14 | 1995-06-27 | Shin Etsu Handotai Co Ltd | Polishing member and wafer polishing device |
US7589023B2 (en) | 2000-04-24 | 2009-09-15 | Sumitomo Mitsubishi Silicon Corporation | Method of manufacturing semiconductor wafer |
DE10196115B4 (en) * | 2000-04-24 | 2011-06-16 | Sumitomo Mitsubishi Silicon Corp. | Method for polishing a semiconductor wafer |
US8283252B2 (en) | 2000-04-24 | 2012-10-09 | Sumitomo Mitsubishi Silicon Corporation | Method of manufacturing semiconductor wafer |
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