JPS5612725A - Method and apparatus for setting position of wafer in projection aligner - Google Patents
Method and apparatus for setting position of wafer in projection alignerInfo
- Publication number
- JPS5612725A JPS5612725A JP8692679A JP8692679A JPS5612725A JP S5612725 A JPS5612725 A JP S5612725A JP 8692679 A JP8692679 A JP 8692679A JP 8692679 A JP8692679 A JP 8692679A JP S5612725 A JPS5612725 A JP S5612725A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- parallelism
- reference value
- paralleling
- projection aligner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To increase the resolution in the periphery of the wafer by aligning the wafer surface on a reference surface with a projection aligner, measuring the parallelism of the wafer, and paralleling the wafer so that the parallelism lies within a specified reference value. CONSTITUTION:The wafer 5 is attracted to a wafter chuck 2 by vacuum, and contacted with leveling pads 1A-1C. After the paralleling alignment, the wafer is lowered about 50mum. Then, the distances d1-d3 to the surface of the wafer are measured by air micrometers 7A-7C, thereby the parallelism is obtained. If the parallelism does not lie within a reference value, the leveling is repeated several times until the parallelism reaches the specified reference value. When the reference value has been attained, exposure is performed. If the air micrometer 7D is provided at the portion of the paralleling alignment portion 3 corresponding to the center of the wafer 5, the warp and curve of the wafer can be also measured.
Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8692679A JPS5612725A (en) | 1979-07-11 | 1979-07-11 | Method and apparatus for setting position of wafer in projection aligner |
GB7936237A GB2035610B (en) | 1978-10-20 | 1979-10-18 | Wafer projection aligner |
GB8040959A GB2063523B (en) | 1978-10-20 | 1979-10-18 | Wafer position setting apparatus |
GB8040960A GB2063524B (en) | 1978-10-20 | 1979-10-18 | Method of positioning a wafer in a projection aligner |
DE19792942388 DE2942388A1 (en) | 1978-10-20 | 1979-10-19 | SEMICONDUCTOR DEVICE POSITIONING DEVICE |
US06/087,387 US4298273A (en) | 1978-10-20 | 1979-10-22 | Projection aligner and method of positioning a wafer |
SG40884A SG40884G (en) | 1978-10-20 | 1984-06-04 | A method of positioning a wafer in a projection aligner |
SG404/84A SG40484G (en) | 1978-10-20 | 1984-06-04 | Projection aligner |
HK356/85A HK35685A (en) | 1978-10-20 | 1985-05-09 | Projection aligner |
HK361/85A HK36185A (en) | 1978-10-20 | 1985-05-09 | Wafer position setting apparatus |
HK684/85A HK68485A (en) | 1978-10-20 | 1985-09-12 | A method of positioning a wafer in a projection aligner |
MY663/85A MY8500663A (en) | 1978-10-20 | 1985-12-30 | Projection aligner |
MY669/85A MY8500669A (en) | 1978-10-20 | 1985-12-30 | Water position setting apparatus |
MY1985670A MY8500670A (en) | 1978-10-20 | 1985-12-31 | A method of positioning a wafer in a protection aligner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8692679A JPS5612725A (en) | 1979-07-11 | 1979-07-11 | Method and apparatus for setting position of wafer in projection aligner |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60099569A Division JPS611019A (en) | 1985-05-13 | 1985-05-13 | Exposing method |
JP60099570A Division JPS611020A (en) | 1985-05-13 | 1985-05-13 | Exposing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5612725A true JPS5612725A (en) | 1981-02-07 |
Family
ID=13900458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8692679A Pending JPS5612725A (en) | 1978-10-20 | 1979-07-11 | Method and apparatus for setting position of wafer in projection aligner |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5612725A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62198121A (en) * | 1986-02-26 | 1987-09-01 | Toshiba Corp | Exposing apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4888871A (en) * | 1972-02-02 | 1973-11-21 |
-
1979
- 1979-07-11 JP JP8692679A patent/JPS5612725A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4888871A (en) * | 1972-02-02 | 1973-11-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62198121A (en) * | 1986-02-26 | 1987-09-01 | Toshiba Corp | Exposing apparatus |
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