JPS56123338A - Electrical contact material - Google Patents

Electrical contact material

Info

Publication number
JPS56123338A
JPS56123338A JP2627180A JP2627180A JPS56123338A JP S56123338 A JPS56123338 A JP S56123338A JP 2627180 A JP2627180 A JP 2627180A JP 2627180 A JP2627180 A JP 2627180A JP S56123338 A JPS56123338 A JP S56123338A
Authority
JP
Japan
Prior art keywords
contact material
electrical contact
alloy
adhesion
seizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2627180A
Other languages
Japanese (ja)
Other versions
JPH0122340B2 (en
Inventor
Kiyokazu Kojima
Hironori Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP2627180A priority Critical patent/JPS56123338A/en
Publication of JPS56123338A publication Critical patent/JPS56123338A/en
Publication of JPH0122340B2 publication Critical patent/JPH0122340B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an electrical contact material almost free from seizing and having superior adhesion resistance by dispersing a specified element in Pd or a Pd alloy in a specified ratio.
CONSTITUTION: At least one of Li, Be, B, Na, Mg, Al, Si, K, Ca, Ga and Ge is alloyed with or dispersed in Pd or a Pd alloy by 0.01W0.5 W/O. The element is precipitated on the grain boundaries of the grain structure of the Pd or Pd alloy to lower the plasticity of the Pd itself. As a result, the adhesion of contacts to each other due to intermetallic adhesion is prevented, and the seizing of this contact material to dies, a roll, etc. is prevented in working.
COPYRIGHT: (C)1981,JPO&Japio
JP2627180A 1980-03-03 1980-03-03 Electrical contact material Granted JPS56123338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2627180A JPS56123338A (en) 1980-03-03 1980-03-03 Electrical contact material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2627180A JPS56123338A (en) 1980-03-03 1980-03-03 Electrical contact material

Publications (2)

Publication Number Publication Date
JPS56123338A true JPS56123338A (en) 1981-09-28
JPH0122340B2 JPH0122340B2 (en) 1989-04-26

Family

ID=12188608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2627180A Granted JPS56123338A (en) 1980-03-03 1980-03-03 Electrical contact material

Country Status (1)

Country Link
JP (1) JPS56123338A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816040A (en) * 1981-07-17 1983-01-29 Nec Corp Electrical contact
JPS6029438A (en) * 1983-07-28 1985-02-14 Tanaka Kikinzoku Kogyo Kk Sliding contact material
US7749433B2 (en) * 2006-02-08 2010-07-06 8853 S.p.A. High-hardness palladium alloy for use in goldsmith and jeweller's art and manufacturing process thereof
CN102676865A (en) * 2011-03-03 2012-09-19 株式会社百乐 Method for manufacturing palladium alloy and palladium alloy
JP2013001956A (en) * 2011-06-16 2013-01-07 Pilot Corporation Method for producing palladium alloy, and palladium alloy

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816040A (en) * 1981-07-17 1983-01-29 Nec Corp Electrical contact
JPH0515771B2 (en) * 1981-07-17 1993-03-02 Nippon Denki Kk
JPS6029438A (en) * 1983-07-28 1985-02-14 Tanaka Kikinzoku Kogyo Kk Sliding contact material
US7749433B2 (en) * 2006-02-08 2010-07-06 8853 S.p.A. High-hardness palladium alloy for use in goldsmith and jeweller's art and manufacturing process thereof
CN102676865A (en) * 2011-03-03 2012-09-19 株式会社百乐 Method for manufacturing palladium alloy and palladium alloy
CN102676865B (en) * 2011-03-03 2015-11-25 株式会社百乐 The manufacture method of palldium alloy and palldium alloy
JP2013001956A (en) * 2011-06-16 2013-01-07 Pilot Corporation Method for producing palladium alloy, and palladium alloy

Also Published As

Publication number Publication date
JPH0122340B2 (en) 1989-04-26

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