JPS56123338A - Electrical contact material - Google Patents
Electrical contact materialInfo
- Publication number
- JPS56123338A JPS56123338A JP2627180A JP2627180A JPS56123338A JP S56123338 A JPS56123338 A JP S56123338A JP 2627180 A JP2627180 A JP 2627180A JP 2627180 A JP2627180 A JP 2627180A JP S56123338 A JPS56123338 A JP S56123338A
- Authority
- JP
- Japan
- Prior art keywords
- contact material
- electrical contact
- alloy
- adhesion
- seizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To obtain an electrical contact material almost free from seizing and having superior adhesion resistance by dispersing a specified element in Pd or a Pd alloy in a specified ratio.
CONSTITUTION: At least one of Li, Be, B, Na, Mg, Al, Si, K, Ca, Ga and Ge is alloyed with or dispersed in Pd or a Pd alloy by 0.01W0.5 W/O. The element is precipitated on the grain boundaries of the grain structure of the Pd or Pd alloy to lower the plasticity of the Pd itself. As a result, the adhesion of contacts to each other due to intermetallic adhesion is prevented, and the seizing of this contact material to dies, a roll, etc. is prevented in working.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2627180A JPS56123338A (en) | 1980-03-03 | 1980-03-03 | Electrical contact material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2627180A JPS56123338A (en) | 1980-03-03 | 1980-03-03 | Electrical contact material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56123338A true JPS56123338A (en) | 1981-09-28 |
JPH0122340B2 JPH0122340B2 (en) | 1989-04-26 |
Family
ID=12188608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2627180A Granted JPS56123338A (en) | 1980-03-03 | 1980-03-03 | Electrical contact material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56123338A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816040A (en) * | 1981-07-17 | 1983-01-29 | Nec Corp | Electrical contact |
JPS6029438A (en) * | 1983-07-28 | 1985-02-14 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
US7749433B2 (en) * | 2006-02-08 | 2010-07-06 | 8853 S.p.A. | High-hardness palladium alloy for use in goldsmith and jeweller's art and manufacturing process thereof |
CN102676865A (en) * | 2011-03-03 | 2012-09-19 | 株式会社百乐 | Method for manufacturing palladium alloy and palladium alloy |
JP2013001956A (en) * | 2011-06-16 | 2013-01-07 | Pilot Corporation | Method for producing palladium alloy, and palladium alloy |
-
1980
- 1980-03-03 JP JP2627180A patent/JPS56123338A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816040A (en) * | 1981-07-17 | 1983-01-29 | Nec Corp | Electrical contact |
JPH0515771B2 (en) * | 1981-07-17 | 1993-03-02 | Nippon Denki Kk | |
JPS6029438A (en) * | 1983-07-28 | 1985-02-14 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
US7749433B2 (en) * | 2006-02-08 | 2010-07-06 | 8853 S.p.A. | High-hardness palladium alloy for use in goldsmith and jeweller's art and manufacturing process thereof |
CN102676865A (en) * | 2011-03-03 | 2012-09-19 | 株式会社百乐 | Method for manufacturing palladium alloy and palladium alloy |
CN102676865B (en) * | 2011-03-03 | 2015-11-25 | 株式会社百乐 | The manufacture method of palldium alloy and palldium alloy |
JP2013001956A (en) * | 2011-06-16 | 2013-01-07 | Pilot Corporation | Method for producing palladium alloy, and palladium alloy |
Also Published As
Publication number | Publication date |
---|---|
JPH0122340B2 (en) | 1989-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5249916A (en) | Material for electric contact consisting of ag-metal oxides | |
JPS5620135A (en) | High-tensile electrically-conductive copper alloy | |
KR890016193A (en) | Cu Alloy Lead Frame Material for Semiconductor Devices | |
JPS56123338A (en) | Electrical contact material | |
JPS57181339A (en) | Electrical contact material of selectively and internally oxidized silver-tin alloy containing bismuth | |
JPS5346418A (en) | Low melting point alloy | |
JPS57187195A (en) | Silver solder material | |
JPS56102536A (en) | Composite electrical contact material | |
JPS5386622A (en) | Silver-nickel electrical contact point material | |
JPS5314557A (en) | Electrode structure in semiconductor device | |
JPS5471719A (en) | Electrical contact point material | |
JPS5494431A (en) | Electric contact material | |
GB1520724A (en) | Vacuum-type circuit interrupter | |
JPS53128525A (en) | Electrical contact point material | |
JPS5784166A (en) | 3-5 group compound semiconductor device | |
JPS54103764A (en) | Brazing material | |
JPS53103926A (en) | Copper alloy for electric conductor of stable contact resistance and its manufacture | |
JPS5494430A (en) | Electric contact material | |
JPS5669336A (en) | Contact material | |
JPS53110460A (en) | Electrode of compound semiconductor | |
JPS6443911A (en) | Superconductive wire material | |
JPS57145956A (en) | Thin copper alloy wire with high strength and flexibility | |
JPS53143167A (en) | Insb polycrystalline thin film element | |
JPS5516429A (en) | Electrode for ga1-x a xas | |
JPS5562136A (en) | Electrical contact material |