JPS56115549A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56115549A
JPS56115549A JP1886880A JP1886880A JPS56115549A JP S56115549 A JPS56115549 A JP S56115549A JP 1886880 A JP1886880 A JP 1886880A JP 1886880 A JP1886880 A JP 1886880A JP S56115549 A JPS56115549 A JP S56115549A
Authority
JP
Japan
Prior art keywords
tube
evaporator
bellows
condenser
heat transporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1886880A
Other languages
Japanese (ja)
Other versions
JPS6148783B2 (en
Inventor
Haruo Tetsuno
Toshio Mikane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1886880A priority Critical patent/JPS56115549A/en
Publication of JPS56115549A publication Critical patent/JPS56115549A/en
Publication of JPS6148783B2 publication Critical patent/JPS6148783B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the size of the boiling cooling type semiconductor device by constructing a heat transporting tube of an outer metallic tube, an insulator, an insulating tube having inner metallic tube and bellows and connecting the outer tube to a condenser, the inner tube to the end of the bellows and the other end of the bellows to an evaporator. CONSTITUTION:The insulating tube 6 formed of the outer metallic tube 6A via the insulator 6B and the inner metallic tube 6C is connected at the outer tube 6A to the condenser 3, the inner tube 6C is connected to the one end of the bellows 4, and the other end of the bellows is connected to the evaporator 1, and a heat transporting tube 2 is formed between the evaporator and the condenser. A hollow pipe 7 is formed in the heat transporting tube to circulate the cooling medium 8 of liquid phase to the bottom of the evaporator, and liquid phase cooling medium is filled in the entirety. Semiconductor elements 10 and the evaporator are alternately urged, the heat generated in the elements is transmitted to the evaporator, the liquid phase cooling medium is boiled to become air bubbles, which is passed through the heat transporting tube into condenser and thus cooled and liquified. Thus, the boiling cooling semiconductor device for cooling the semiconductor elements can be reduced.
JP1886880A 1980-02-18 1980-02-18 Semiconductor device Granted JPS56115549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1886880A JPS56115549A (en) 1980-02-18 1980-02-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1886880A JPS56115549A (en) 1980-02-18 1980-02-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56115549A true JPS56115549A (en) 1981-09-10
JPS6148783B2 JPS6148783B2 (en) 1986-10-25

Family

ID=11983514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1886880A Granted JPS56115549A (en) 1980-02-18 1980-02-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56115549A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899211A (en) * 1986-01-16 1990-02-06 Jeumont Schneider Corporation Semiconductor cooling mechanisms
CN108036831A (en) * 2018-02-01 2018-05-15 攀枝花学院 Fluid flow detection circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899211A (en) * 1986-01-16 1990-02-06 Jeumont Schneider Corporation Semiconductor cooling mechanisms
CN108036831A (en) * 2018-02-01 2018-05-15 攀枝花学院 Fluid flow detection circuit

Also Published As

Publication number Publication date
JPS6148783B2 (en) 1986-10-25

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