JPS56114349A - Detecting method for displacement in testing stage of wafer - Google Patents
Detecting method for displacement in testing stage of waferInfo
- Publication number
- JPS56114349A JPS56114349A JP1766680A JP1766680A JPS56114349A JP S56114349 A JPS56114349 A JP S56114349A JP 1766680 A JP1766680 A JP 1766680A JP 1766680 A JP1766680 A JP 1766680A JP S56114349 A JPS56114349 A JP S56114349A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- displacement
- tip
- contact
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/316—Testing of analog circuits
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To detect a position displacement accurately by a method wherein the contact of a probe for detection with displacement detecting pads is started when a contacting area between the pad and the probe becomes smaller than an area of a tip of a probe, and the existence of continuity with the probe keeping contact with a return pad during contact is utilized. CONSTITUTION:When a displacement occurs in indexing action and a contacting area between a probe 9 and a connecting pad of a semiconductor chip 2 reaches about half of an area of a tip section, the contact of a tip of a probe 10 for detection with either of pads 51-54 for detecting the displacement is started, and the tip of the probe 10 is conducted with a pad 6 for return through the corresponding electric circuits of electric circuits 71-74. Thus, the indexing direction in which the displacement is generated can easily by detected by means of a comparator circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1766680A JPS56114349A (en) | 1980-02-15 | 1980-02-15 | Detecting method for displacement in testing stage of wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1766680A JPS56114349A (en) | 1980-02-15 | 1980-02-15 | Detecting method for displacement in testing stage of wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56114349A true JPS56114349A (en) | 1981-09-08 |
Family
ID=11950170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1766680A Pending JPS56114349A (en) | 1980-02-15 | 1980-02-15 | Detecting method for displacement in testing stage of wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56114349A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59226167A (en) * | 1983-06-04 | 1984-12-19 | Dainippon Screen Mfg Co Ltd | Surface treating device for circuit board |
JPS6030147A (en) * | 1983-07-28 | 1985-02-15 | Nec Corp | Semiconductor wafer |
JPS60142526A (en) * | 1983-12-29 | 1985-07-27 | Toshiba Corp | Measurement of electrical characteristics of semiconductor element |
JPH02137350A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Semiconductor integrated circuit |
JP2005333128A (en) * | 2004-05-18 | 2005-12-02 | Samsung Electronics Co Ltd | Probe pad, substrate having semiconductor device, method of testing semiconductor device and tester for testing semiconductor device |
JP2006147601A (en) * | 2004-11-16 | 2006-06-08 | Matsushita Electric Ind Co Ltd | Semiconductor wafer and method of inspecting it |
JP2007158346A (en) * | 2005-12-02 | 2007-06-21 | Samsung Electronics Co Ltd | Probe sensing pad and method of detecting contact position of probe needle |
JP2007335550A (en) * | 2006-06-14 | 2007-12-27 | Seiko Instruments Inc | Semiconductor device |
KR100897982B1 (en) | 2007-09-27 | 2009-05-18 | 주식회사 동부하이텍 | Miss align preventing pattern and method thereof between probe card niddle and pad |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318972A (en) * | 1976-08-05 | 1978-02-21 | Nec Corp | Monitoring method of wafer positioning state by probes |
JPS5688333A (en) * | 1979-12-21 | 1981-07-17 | Hitachi Ltd | Detecting method of relative position between probe and contact |
-
1980
- 1980-02-15 JP JP1766680A patent/JPS56114349A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5318972A (en) * | 1976-08-05 | 1978-02-21 | Nec Corp | Monitoring method of wafer positioning state by probes |
JPS5688333A (en) * | 1979-12-21 | 1981-07-17 | Hitachi Ltd | Detecting method of relative position between probe and contact |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59226167A (en) * | 1983-06-04 | 1984-12-19 | Dainippon Screen Mfg Co Ltd | Surface treating device for circuit board |
JPS6030147A (en) * | 1983-07-28 | 1985-02-15 | Nec Corp | Semiconductor wafer |
JPS60142526A (en) * | 1983-12-29 | 1985-07-27 | Toshiba Corp | Measurement of electrical characteristics of semiconductor element |
JPH02137350A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Semiconductor integrated circuit |
JP2005333128A (en) * | 2004-05-18 | 2005-12-02 | Samsung Electronics Co Ltd | Probe pad, substrate having semiconductor device, method of testing semiconductor device and tester for testing semiconductor device |
JP2006147601A (en) * | 2004-11-16 | 2006-06-08 | Matsushita Electric Ind Co Ltd | Semiconductor wafer and method of inspecting it |
JP4570446B2 (en) * | 2004-11-16 | 2010-10-27 | パナソニック株式会社 | Semiconductor wafer and inspection method thereof |
US7612573B2 (en) | 2005-05-17 | 2009-11-03 | Samsung Electronics Co., Ltd. | Probe sensing pads and methods of detecting positions of probe needles relative to probe sensing pads |
JP2007158346A (en) * | 2005-12-02 | 2007-06-21 | Samsung Electronics Co Ltd | Probe sensing pad and method of detecting contact position of probe needle |
KR100739629B1 (en) | 2005-12-02 | 2007-07-16 | 삼성전자주식회사 | Pad for probe sensing and method for inspection contact site of probe needle using the same |
JP2007335550A (en) * | 2006-06-14 | 2007-12-27 | Seiko Instruments Inc | Semiconductor device |
KR100897982B1 (en) | 2007-09-27 | 2009-05-18 | 주식회사 동부하이텍 | Miss align preventing pattern and method thereof between probe card niddle and pad |
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