JPS56104457A - Cooler for electronic device - Google Patents
Cooler for electronic deviceInfo
- Publication number
- JPS56104457A JPS56104457A JP667580A JP667580A JPS56104457A JP S56104457 A JPS56104457 A JP S56104457A JP 667580 A JP667580 A JP 667580A JP 667580 A JP667580 A JP 667580A JP S56104457 A JPS56104457 A JP S56104457A
- Authority
- JP
- Japan
- Prior art keywords
- cooler
- unit
- heat dissipating
- cooling
- cooling pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To facilitate the exchange and repair of an electronic part and a cooling plate in the cooler by providing the cooling plate welded with a plurality of parallel cooling pipes between two metallic plates detachably to the connector for connecting the heat dissipating unit. CONSTITUTION:The cooling plate 1 formed by welding a plurality of aligned cooling pipes 2 to the metallic plate 3 formed of copper or the like from both sides is fixedly inserted into the groove formed with the connector body 5 and the dividing pieces 6 as connected to the heat dissipating unit 8. The unit 8 is so constructed as to circulate the refrigerant between the heat dissipating fin and the cooling pipes. When the electronic part such as semiconductor chip or the like and the circuit board carrying the chip malfunctions or the cooler unit is broken down, they can be individually exchanged or repaired.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP667580A JPS56104457A (en) | 1980-01-23 | 1980-01-23 | Cooler for electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP667580A JPS56104457A (en) | 1980-01-23 | 1980-01-23 | Cooler for electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56104457A true JPS56104457A (en) | 1981-08-20 |
Family
ID=11644936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP667580A Pending JPS56104457A (en) | 1980-01-23 | 1980-01-23 | Cooler for electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56104457A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6621707B2 (en) | 1998-08-11 | 2003-09-16 | Fujitsu Limited | Liquid-cooled electronic apparatus |
JP2013134993A (en) * | 2011-12-22 | 2013-07-08 | Samsung Sdi Co Ltd | Battery module |
-
1980
- 1980-01-23 JP JP667580A patent/JPS56104457A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6621707B2 (en) | 1998-08-11 | 2003-09-16 | Fujitsu Limited | Liquid-cooled electronic apparatus |
JP2013134993A (en) * | 2011-12-22 | 2013-07-08 | Samsung Sdi Co Ltd | Battery module |
CN106935932A (en) * | 2011-12-22 | 2017-07-07 | 三星Sdi株式会社 | Battery module |
CN106935932B (en) * | 2011-12-22 | 2020-08-18 | 三星Sdi株式会社 | Battery module |
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