JPS56104457A - Cooler for electronic device - Google Patents

Cooler for electronic device

Info

Publication number
JPS56104457A
JPS56104457A JP667580A JP667580A JPS56104457A JP S56104457 A JPS56104457 A JP S56104457A JP 667580 A JP667580 A JP 667580A JP 667580 A JP667580 A JP 667580A JP S56104457 A JPS56104457 A JP S56104457A
Authority
JP
Japan
Prior art keywords
cooler
unit
heat dissipating
cooling
cooling pipes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP667580A
Other languages
Japanese (ja)
Inventor
Takashi Kawakami
Etsuro Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP667580A priority Critical patent/JPS56104457A/en
Publication of JPS56104457A publication Critical patent/JPS56104457A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To facilitate the exchange and repair of an electronic part and a cooling plate in the cooler by providing the cooling plate welded with a plurality of parallel cooling pipes between two metallic plates detachably to the connector for connecting the heat dissipating unit. CONSTITUTION:The cooling plate 1 formed by welding a plurality of aligned cooling pipes 2 to the metallic plate 3 formed of copper or the like from both sides is fixedly inserted into the groove formed with the connector body 5 and the dividing pieces 6 as connected to the heat dissipating unit 8. The unit 8 is so constructed as to circulate the refrigerant between the heat dissipating fin and the cooling pipes. When the electronic part such as semiconductor chip or the like and the circuit board carrying the chip malfunctions or the cooler unit is broken down, they can be individually exchanged or repaired.
JP667580A 1980-01-23 1980-01-23 Cooler for electronic device Pending JPS56104457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP667580A JPS56104457A (en) 1980-01-23 1980-01-23 Cooler for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP667580A JPS56104457A (en) 1980-01-23 1980-01-23 Cooler for electronic device

Publications (1)

Publication Number Publication Date
JPS56104457A true JPS56104457A (en) 1981-08-20

Family

ID=11644936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP667580A Pending JPS56104457A (en) 1980-01-23 1980-01-23 Cooler for electronic device

Country Status (1)

Country Link
JP (1) JPS56104457A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621707B2 (en) 1998-08-11 2003-09-16 Fujitsu Limited Liquid-cooled electronic apparatus
JP2013134993A (en) * 2011-12-22 2013-07-08 Samsung Sdi Co Ltd Battery module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621707B2 (en) 1998-08-11 2003-09-16 Fujitsu Limited Liquid-cooled electronic apparatus
JP2013134993A (en) * 2011-12-22 2013-07-08 Samsung Sdi Co Ltd Battery module
CN106935932A (en) * 2011-12-22 2017-07-07 三星Sdi株式会社 Battery module
CN106935932B (en) * 2011-12-22 2020-08-18 三星Sdi株式会社 Battery module

Similar Documents

Publication Publication Date Title
ES8602339A1 (en) Printed circuit board assembly having a liquid-cooling module system.
JPS56118314A (en) Heat exchanger for cooling power device
CN207343936U (en) A kind of wave-soldering substrate-pressing jig
US4714107A (en) Titanium heat exchanger for laser cooling
US10524382B2 (en) System and method for forced air cooling of electrical device
JPS57103337A (en) Heat transfer connecting device and manufacture thereof
JPS56104457A (en) Cooler for electronic device
GB1032236A (en) Method of making a thermo-electric assembly
CN106298705B (en) A kind of power MOS pipe and its manufacturing method
CN207625905U (en) It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT
CN115666013A (en) Through hole reflow soldering equipment
CN201426226Y (en) Electronic component integration board
CN107820380A (en) A kind of liquid cooling plate and its cold and hot exchange method
CN209861258U (en) Module circuit
EP0281404A3 (en) Cooling system for electronic equipment
CN207719869U (en) A kind of energy-saving charger of low energy consumption
JPS55134952A (en) Mounting of ic package
JPS649646A (en) Cooling module
JPH0534113Y2 (en)
JPS6436057A (en) Cooling mechanism of electronic apparatus
CN208113217U (en) Water cooling plate and computing equipment comprising same
JPS5336629A (en) Process for making radiating container for use in oil inclusive electrical equipment
JPH01122195A (en) Cooling structure of electronic equipment
JPS6428944A (en) Cooling structure of integrated circuit
GB1592072A (en) Heat dissipation arrangements for printed circuit boards