JPS56101745A - Formation of microminiature electrode - Google Patents
Formation of microminiature electrodeInfo
- Publication number
- JPS56101745A JPS56101745A JP422480A JP422480A JPS56101745A JP S56101745 A JPS56101745 A JP S56101745A JP 422480 A JP422480 A JP 422480A JP 422480 A JP422480 A JP 422480A JP S56101745 A JPS56101745 A JP S56101745A
- Authority
- JP
- Japan
- Prior art keywords
- ion beam
- layer
- electrode material
- resist layer
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Abstract
PURPOSE:To form a microminiature electrode pattern by irradiating an ion beam to the part of an electrode material layer formed through a resist on a substrate as adhered to the end surface of the thickness of the resist layer or etching the resist layer with other ion beam. CONSTITUTION:A photoresist layer 2 of predetermined pattern is formed on the semiconductor substrate 1, the electrode material layer 4 of aluminum or the like is formed on the entire surface, then the ion beam 5 of Ar or the like is obliquely rotatably irradiated thereto so as to remove the electrode material layer 4' adhered to the end surface of the resist layer, thereafter oxygen ion beam is irradiated thereto, and the electrode material layer on the resist layer 2 and the resist layer 2 are removed. Since the microminiature electrode pattern can be thus lifted off by dry etching in this manner, it can simplify the setps and labor-save the process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP422480A JPS56101745A (en) | 1980-01-17 | 1980-01-17 | Formation of microminiature electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP422480A JPS56101745A (en) | 1980-01-17 | 1980-01-17 | Formation of microminiature electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56101745A true JPS56101745A (en) | 1981-08-14 |
Family
ID=11578611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP422480A Pending JPS56101745A (en) | 1980-01-17 | 1980-01-17 | Formation of microminiature electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56101745A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02253615A (en) * | 1989-03-27 | 1990-10-12 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
JP2013029670A (en) * | 2011-07-28 | 2013-02-07 | Denso Corp | Method of manufacturing semiconductor device |
-
1980
- 1980-01-17 JP JP422480A patent/JPS56101745A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02253615A (en) * | 1989-03-27 | 1990-10-12 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
JP2013029670A (en) * | 2011-07-28 | 2013-02-07 | Denso Corp | Method of manufacturing semiconductor device |
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