JPS5586812A - Aqueous polyamideimide resin composition - Google Patents

Aqueous polyamideimide resin composition

Info

Publication number
JPS5586812A
JPS5586812A JP16224678A JP16224678A JPS5586812A JP S5586812 A JPS5586812 A JP S5586812A JP 16224678 A JP16224678 A JP 16224678A JP 16224678 A JP16224678 A JP 16224678A JP S5586812 A JPS5586812 A JP S5586812A
Authority
JP
Japan
Prior art keywords
carboxylic acid
isocyanate
per molecule
groups per
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16224678A
Other languages
Japanese (ja)
Other versions
JPS606367B2 (en
Inventor
Taisuke Okada
Hiroshi Nishizawa
Yoshiyuki Mukoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP53162246A priority Critical patent/JPS606367B2/en
Publication of JPS5586812A publication Critical patent/JPS5586812A/en
Publication of JPS606367B2 publication Critical patent/JPS606367B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE: The low-priced title compound capable of forming a molded article or a film having improved heat resistance, consisting of a specific polyamide-imide resin, water, and a basic compound.
CONSTITUTION: A) A polyamide-imide resin is obtained by reacting a) a polyfunctional isocyanate having an isocyanurate ring prepared from a diisocyanate with b) a polyfunctional isocyanate (functional derivative) having two or more isocyanate groups per molecule, c) a polyfunctional carboxylic acid (functional derivative) having one or more acid anhydride groups per molecule, and, if necessary, d) a polyfunctional carboxylic acid (functional derivative) having two or more carboxyl groups per molecule in the equivalent ratio of carboxylic acid to isocyanate component of 1.3/1.0W1.0/1.3 in an organic solvent at 60W200°C. A) The polyamide- imide resin is blended with B) 10W50wt% of a basic compound, e.g., triethylamine, methylaniline and water.
COPYRIGHT: (C)1980,JPO&Japio
JP53162246A 1978-12-26 1978-12-26 Water-based polyamide-imide resin composition Expired JPS606367B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53162246A JPS606367B2 (en) 1978-12-26 1978-12-26 Water-based polyamide-imide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53162246A JPS606367B2 (en) 1978-12-26 1978-12-26 Water-based polyamide-imide resin composition

Publications (2)

Publication Number Publication Date
JPS5586812A true JPS5586812A (en) 1980-07-01
JPS606367B2 JPS606367B2 (en) 1985-02-18

Family

ID=15750764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53162246A Expired JPS606367B2 (en) 1978-12-26 1978-12-26 Water-based polyamide-imide resin composition

Country Status (1)

Country Link
JP (1) JPS606367B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122244B2 (en) * 2000-08-25 2006-10-17 Altana Electrical Insulation Gmbh Polyamide-imide resin solution and the use thereof for producing wire enamels
WO2014034642A1 (en) * 2012-08-30 2014-03-06 東洋紡株式会社 Polyamide-imide resin composition for lubricating coating material
JP2014062237A (en) * 2012-08-30 2014-04-10 Toyobo Co Ltd Polyamide-imide resin composition for lubricating coating material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122244B2 (en) * 2000-08-25 2006-10-17 Altana Electrical Insulation Gmbh Polyamide-imide resin solution and the use thereof for producing wire enamels
WO2014034642A1 (en) * 2012-08-30 2014-03-06 東洋紡株式会社 Polyamide-imide resin composition for lubricating coating material
JP2014062237A (en) * 2012-08-30 2014-04-10 Toyobo Co Ltd Polyamide-imide resin composition for lubricating coating material

Also Published As

Publication number Publication date
JPS606367B2 (en) 1985-02-18

Similar Documents

Publication Publication Date Title
JPS5545774A (en) Epoxy resin composition
JPS5698221A (en) Curable resin composition
JPS5586812A (en) Aqueous polyamideimide resin composition
JPS5785820A (en) Novel resin composition, paint containing said resin composition and painting thereof
JPS56112933A (en) Thermoplastic polyamide-imide copolymer and production thereof
JPS54142298A (en) Heat-resistant curable resin composition
JPS5352542A (en) Cold curing high solid coatng composition
JPS5645944A (en) Polycarbonate resin composition
JPS54148026A (en) Low-temperature curing coating composition
JPS5521461A (en) Resin composition
JPS5566927A (en) Curable resin composition
JPS5262337A (en) Resin compositions for powder coatings
JPS5316046A (en) Preparation of insulating coating
JPS54118436A (en) Powder coating resin composition
JPS5650923A (en) Polyester molding material and its manufacture
JPS55115423A (en) Manufacture of adamantane-epoxy resin
JPS5488932A (en) Resin composition for coating powder
JPS5477661A (en) Crosslinked or uncrosslinked linear aromatic polyester composition and its production
JPS5580426A (en) Preparation of polyamide-imide resin and water-soluble polyamide-imide resin
JPS5516054A (en) Heat-resistant coating composition
JPS5552342A (en) Polyethylene terephthalate resin molding compound having excellent mar resistance
JPS55123617A (en) Polyamide-imide resin composition soluble in cresol-type solvent
JPS5252994A (en) Preparation of polyamide acid
JPS5473899A (en) Curing agent for epoxy resin
JPS5325663A (en) Vinyl resin composition capable of chelate formation