JPS5586812A - Aqueous polyamideimide resin composition - Google Patents
Aqueous polyamideimide resin compositionInfo
- Publication number
- JPS5586812A JPS5586812A JP16224678A JP16224678A JPS5586812A JP S5586812 A JPS5586812 A JP S5586812A JP 16224678 A JP16224678 A JP 16224678A JP 16224678 A JP16224678 A JP 16224678A JP S5586812 A JPS5586812 A JP S5586812A
- Authority
- JP
- Japan
- Prior art keywords
- carboxylic acid
- isocyanate
- per molecule
- groups per
- polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
Abstract
PURPOSE: The low-priced title compound capable of forming a molded article or a film having improved heat resistance, consisting of a specific polyamide-imide resin, water, and a basic compound.
CONSTITUTION: A) A polyamide-imide resin is obtained by reacting a) a polyfunctional isocyanate having an isocyanurate ring prepared from a diisocyanate with b) a polyfunctional isocyanate (functional derivative) having two or more isocyanate groups per molecule, c) a polyfunctional carboxylic acid (functional derivative) having one or more acid anhydride groups per molecule, and, if necessary, d) a polyfunctional carboxylic acid (functional derivative) having two or more carboxyl groups per molecule in the equivalent ratio of carboxylic acid to isocyanate component of 1.3/1.0W1.0/1.3 in an organic solvent at 60W200°C. A) The polyamide- imide resin is blended with B) 10W50wt% of a basic compound, e.g., triethylamine, methylaniline and water.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53162246A JPS606367B2 (en) | 1978-12-26 | 1978-12-26 | Water-based polyamide-imide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53162246A JPS606367B2 (en) | 1978-12-26 | 1978-12-26 | Water-based polyamide-imide resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5586812A true JPS5586812A (en) | 1980-07-01 |
JPS606367B2 JPS606367B2 (en) | 1985-02-18 |
Family
ID=15750764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53162246A Expired JPS606367B2 (en) | 1978-12-26 | 1978-12-26 | Water-based polyamide-imide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS606367B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7122244B2 (en) * | 2000-08-25 | 2006-10-17 | Altana Electrical Insulation Gmbh | Polyamide-imide resin solution and the use thereof for producing wire enamels |
WO2014034642A1 (en) * | 2012-08-30 | 2014-03-06 | 東洋紡株式会社 | Polyamide-imide resin composition for lubricating coating material |
JP2014062237A (en) * | 2012-08-30 | 2014-04-10 | Toyobo Co Ltd | Polyamide-imide resin composition for lubricating coating material |
-
1978
- 1978-12-26 JP JP53162246A patent/JPS606367B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7122244B2 (en) * | 2000-08-25 | 2006-10-17 | Altana Electrical Insulation Gmbh | Polyamide-imide resin solution and the use thereof for producing wire enamels |
WO2014034642A1 (en) * | 2012-08-30 | 2014-03-06 | 東洋紡株式会社 | Polyamide-imide resin composition for lubricating coating material |
JP2014062237A (en) * | 2012-08-30 | 2014-04-10 | Toyobo Co Ltd | Polyamide-imide resin composition for lubricating coating material |
Also Published As
Publication number | Publication date |
---|---|
JPS606367B2 (en) | 1985-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5545774A (en) | Epoxy resin composition | |
JPS5698221A (en) | Curable resin composition | |
JPS5586812A (en) | Aqueous polyamideimide resin composition | |
JPS5785820A (en) | Novel resin composition, paint containing said resin composition and painting thereof | |
JPS56112933A (en) | Thermoplastic polyamide-imide copolymer and production thereof | |
JPS54142298A (en) | Heat-resistant curable resin composition | |
JPS5352542A (en) | Cold curing high solid coatng composition | |
JPS5645944A (en) | Polycarbonate resin composition | |
JPS54148026A (en) | Low-temperature curing coating composition | |
JPS5521461A (en) | Resin composition | |
JPS5566927A (en) | Curable resin composition | |
JPS5262337A (en) | Resin compositions for powder coatings | |
JPS5316046A (en) | Preparation of insulating coating | |
JPS54118436A (en) | Powder coating resin composition | |
JPS5650923A (en) | Polyester molding material and its manufacture | |
JPS55115423A (en) | Manufacture of adamantane-epoxy resin | |
JPS5488932A (en) | Resin composition for coating powder | |
JPS5477661A (en) | Crosslinked or uncrosslinked linear aromatic polyester composition and its production | |
JPS5580426A (en) | Preparation of polyamide-imide resin and water-soluble polyamide-imide resin | |
JPS5516054A (en) | Heat-resistant coating composition | |
JPS5552342A (en) | Polyethylene terephthalate resin molding compound having excellent mar resistance | |
JPS55123617A (en) | Polyamide-imide resin composition soluble in cresol-type solvent | |
JPS5252994A (en) | Preparation of polyamide acid | |
JPS5473899A (en) | Curing agent for epoxy resin | |
JPS5325663A (en) | Vinyl resin composition capable of chelate formation |