JPS5586190A - Method of soldering lead terminal - Google Patents

Method of soldering lead terminal

Info

Publication number
JPS5586190A
JPS5586190A JP15861878A JP15861878A JPS5586190A JP S5586190 A JPS5586190 A JP S5586190A JP 15861878 A JP15861878 A JP 15861878A JP 15861878 A JP15861878 A JP 15861878A JP S5586190 A JPS5586190 A JP S5586190A
Authority
JP
Japan
Prior art keywords
lead terminal
soldering lead
soldering
terminal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15861878A
Other languages
Japanese (ja)
Inventor
Shiyuuji Takeshita
Masao Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15861878A priority Critical patent/JPS5586190A/en
Publication of JPS5586190A publication Critical patent/JPS5586190A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15861878A 1978-12-25 1978-12-25 Method of soldering lead terminal Pending JPS5586190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15861878A JPS5586190A (en) 1978-12-25 1978-12-25 Method of soldering lead terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15861878A JPS5586190A (en) 1978-12-25 1978-12-25 Method of soldering lead terminal

Publications (1)

Publication Number Publication Date
JPS5586190A true JPS5586190A (en) 1980-06-28

Family

ID=15675637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15861878A Pending JPS5586190A (en) 1978-12-25 1978-12-25 Method of soldering lead terminal

Country Status (1)

Country Link
JP (1) JPS5586190A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992010078A1 (en) * 1990-11-28 1992-06-11 Nihon Almit Co., Ltd. Device for soldering
JPH0831689B1 (en) * 1990-11-28 1996-03-27 Nippon Almit Kk
JPH09116079A (en) * 1995-10-13 1997-05-02 Nec Corp Surface mounting of resin-sealed semiconductor device
JP2007180457A (en) * 2005-12-28 2007-07-12 Toyota Industries Corp Soldering method, method of manufacturing semiconductor module, and soldering apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992010078A1 (en) * 1990-11-28 1992-06-11 Nihon Almit Co., Ltd. Device for soldering
JPH0831689B1 (en) * 1990-11-28 1996-03-27 Nippon Almit Kk
JPH09116079A (en) * 1995-10-13 1997-05-02 Nec Corp Surface mounting of resin-sealed semiconductor device
JP2007180457A (en) * 2005-12-28 2007-07-12 Toyota Industries Corp Soldering method, method of manufacturing semiconductor module, and soldering apparatus

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