JPS5586190A - Method of soldering lead terminal - Google Patents
Method of soldering lead terminalInfo
- Publication number
- JPS5586190A JPS5586190A JP15861878A JP15861878A JPS5586190A JP S5586190 A JPS5586190 A JP S5586190A JP 15861878 A JP15861878 A JP 15861878A JP 15861878 A JP15861878 A JP 15861878A JP S5586190 A JPS5586190 A JP S5586190A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- soldering lead
- soldering
- terminal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15861878A JPS5586190A (en) | 1978-12-25 | 1978-12-25 | Method of soldering lead terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15861878A JPS5586190A (en) | 1978-12-25 | 1978-12-25 | Method of soldering lead terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5586190A true JPS5586190A (en) | 1980-06-28 |
Family
ID=15675637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15861878A Pending JPS5586190A (en) | 1978-12-25 | 1978-12-25 | Method of soldering lead terminal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5586190A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992010078A1 (en) * | 1990-11-28 | 1992-06-11 | Nihon Almit Co., Ltd. | Device for soldering |
JPH0831689B1 (en) * | 1990-11-28 | 1996-03-27 | Nippon Almit Kk | |
JPH09116079A (en) * | 1995-10-13 | 1997-05-02 | Nec Corp | Surface mounting of resin-sealed semiconductor device |
JP2007180457A (en) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | Soldering method, method of manufacturing semiconductor module, and soldering apparatus |
-
1978
- 1978-12-25 JP JP15861878A patent/JPS5586190A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992010078A1 (en) * | 1990-11-28 | 1992-06-11 | Nihon Almit Co., Ltd. | Device for soldering |
JPH0831689B1 (en) * | 1990-11-28 | 1996-03-27 | Nippon Almit Kk | |
JPH09116079A (en) * | 1995-10-13 | 1997-05-02 | Nec Corp | Surface mounting of resin-sealed semiconductor device |
JP2007180457A (en) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | Soldering method, method of manufacturing semiconductor module, and soldering apparatus |
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