JPS558062A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPS558062A JPS558062A JP8076178A JP8076178A JPS558062A JP S558062 A JPS558062 A JP S558062A JP 8076178 A JP8076178 A JP 8076178A JP 8076178 A JP8076178 A JP 8076178A JP S558062 A JPS558062 A JP S558062A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- sio2
- gate
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:For avoiding the fall of the threshold value of voltage, to raise the voltage resistance between a second gate electrode and a semiconductor substrate by providing thick oxidized film in the vicinity of first and second gate oxidized gate films and to decrease the capacitors between said first and second gate electrodes. CONSTITUTION:Thick field SiO2 films 16 are formed at the both and edges of a P-type Si substrate 11, and thin SiO2 film 17 is deposited on the portion surrounded by said film 16 of said substrate 11. Next, polycrystalline Si film 18 is deposited on the whole surface of said substrate 11, and SiO2 film 19' is provided at a given place on said substrate 11. A first gate electrode 18' is formed by removing the exposed portion of said film 18 and the underlying portion of said film 17 by plasma etching with said film 19' used as mask. Next, an N-type range 20 is formed on the exposed end portion of said electrode 18' by P ion injection, said film 19' is removed, and an extension 21 of SiO2 film is formed on the remainder film portion 17'. Next, thick SiO2 film 22 is bred over the whole surface of said substrate 11, and a second gate electrode 23 is formed of polycrystalline Si thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8076178A JPS558062A (en) | 1978-07-03 | 1978-07-03 | Manufacture of semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8076178A JPS558062A (en) | 1978-07-03 | 1978-07-03 | Manufacture of semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS558062A true JPS558062A (en) | 1980-01-21 |
Family
ID=13727391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8076178A Pending JPS558062A (en) | 1978-07-03 | 1978-07-03 | Manufacture of semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS558062A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56144535A (en) * | 1980-04-11 | 1981-11-10 | Hitachi Ltd | Manufacture of semiconductor device |
JPS5889869A (en) * | 1981-11-20 | 1983-05-28 | Matsushita Electronics Corp | Manufacture of semiconductor device |
-
1978
- 1978-07-03 JP JP8076178A patent/JPS558062A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56144535A (en) * | 1980-04-11 | 1981-11-10 | Hitachi Ltd | Manufacture of semiconductor device |
JPS5889869A (en) * | 1981-11-20 | 1983-05-28 | Matsushita Electronics Corp | Manufacture of semiconductor device |
JPS6312389B2 (en) * | 1981-11-20 | 1988-03-18 | Matsushita Electronics Corp |
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