JPS5578013A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5578013A JPS5578013A JP15183778A JP15183778A JPS5578013A JP S5578013 A JPS5578013 A JP S5578013A JP 15183778 A JP15183778 A JP 15183778A JP 15183778 A JP15183778 A JP 15183778A JP S5578013 A JPS5578013 A JP S5578013A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- room temperature
- resin composition
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To obtain an epoxy resin composition with low toxicity and viscosity, by mixing an imidazole curing agent which is a liquid at room temperature with a curable epoxy compound and a specific reactive diluent.
CONSTITUTION: (A) 50W100 Parts by wt. of a polyhydric phenol polyglycidyl ether epoxy resin is mixed with (B) 5W50 parts by wt. of a mono- or di-tert-(and/ or sec)butyl phenyl glycidyl ether as a reactive diluent, and (C) 2 parts by wt. of an imidazole curing agent, e.g. 2-ethyl-4-methylimidazole, which is a liquid at room temperature, to give the objective composition.
EFFECT: Usable as wet laminating vanishes because of no solvent, and high operating efficiency due to quick curability without polluting the working atmosphere. Relatively long pot life.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15183778A JPS5578013A (en) | 1978-12-06 | 1978-12-06 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15183778A JPS5578013A (en) | 1978-12-06 | 1978-12-06 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5578013A true JPS5578013A (en) | 1980-06-12 |
JPS5720327B2 JPS5720327B2 (en) | 1982-04-28 |
Family
ID=15527375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15183778A Granted JPS5578013A (en) | 1978-12-06 | 1978-12-06 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5578013A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4495317A (en) * | 1980-04-25 | 1985-01-22 | Deft Chemical Coatings, Inc. | Warer reducible epoxy coating composition |
JPS61221279A (en) * | 1985-03-28 | 1986-10-01 | Nippon Retsuku Kk | One-pack type insulating adhesive for metal and flexible film |
WO2017030988A1 (en) * | 2015-08-14 | 2017-02-23 | Cytec Industries Inc. | Fast-cure pre-preg |
-
1978
- 1978-12-06 JP JP15183778A patent/JPS5578013A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4495317A (en) * | 1980-04-25 | 1985-01-22 | Deft Chemical Coatings, Inc. | Warer reducible epoxy coating composition |
JPS61221279A (en) * | 1985-03-28 | 1986-10-01 | Nippon Retsuku Kk | One-pack type insulating adhesive for metal and flexible film |
JPH0325468B2 (en) * | 1985-03-28 | 1991-04-08 | Nippon Retsuku Kk | |
WO2017030988A1 (en) * | 2015-08-14 | 2017-02-23 | Cytec Industries Inc. | Fast-cure pre-preg |
US11149125B2 (en) | 2015-08-14 | 2021-10-19 | Cytec Industries Inc. | Fast-cure pre-preg |
Also Published As
Publication number | Publication date |
---|---|
JPS5720327B2 (en) | 1982-04-28 |
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