JPS5577850U - - Google Patents

Info

Publication number
JPS5577850U
JPS5577850U JP16221078U JP16221078U JPS5577850U JP S5577850 U JPS5577850 U JP S5577850U JP 16221078 U JP16221078 U JP 16221078U JP 16221078 U JP16221078 U JP 16221078U JP S5577850 U JPS5577850 U JP S5577850U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16221078U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16221078U priority Critical patent/JPS5577850U/ja
Publication of JPS5577850U publication Critical patent/JPS5577850U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16221078U 1978-11-24 1978-11-24 Pending JPS5577850U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16221078U JPS5577850U (ja) 1978-11-24 1978-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16221078U JPS5577850U (ja) 1978-11-24 1978-11-24

Publications (1)

Publication Number Publication Date
JPS5577850U true JPS5577850U (ja) 1980-05-29

Family

ID=29157696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16221078U Pending JPS5577850U (ja) 1978-11-24 1978-11-24

Country Status (1)

Country Link
JP (1) JPS5577850U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272043A (ja) * 1987-04-30 1988-11-09 Mitsui Haitetsuku:Kk 半導体装置およびその製造方法
JPH0483352A (ja) * 1990-07-25 1992-03-17 Mitsubishi Electric Corp 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272043A (ja) * 1987-04-30 1988-11-09 Mitsui Haitetsuku:Kk 半導体装置およびその製造方法
JPH0483352A (ja) * 1990-07-25 1992-03-17 Mitsubishi Electric Corp 半導体装置

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