JPS5575893A - Production of solder - Google Patents
Production of solderInfo
- Publication number
- JPS5575893A JPS5575893A JP14984478A JP14984478A JPS5575893A JP S5575893 A JPS5575893 A JP S5575893A JP 14984478 A JP14984478 A JP 14984478A JP 14984478 A JP14984478 A JP 14984478A JP S5575893 A JPS5575893 A JP S5575893A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- solder
- solder base
- phosphorus
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Abstract
PURPOSE:To apply wetting property to the solder base, and prevent oxidation when melting, by coexisting phosphorus in a solder base of which principal components are Pb and Sn or In, mixing with a specified content of phosphorus. CONSTITUTION:As the solder base to be used, for example, Pb-Sn alloy, Pb-Sn-Ag alloy, Pb-Sn-Sb alloy, and Pb-In alloy may be useful. The coexisting conditions for phosphorus include the method of adding by forming mother alloy with one componet of the solder base, and the method of directly adding phosphorus into the solder base. The solder is melted so that the phosphorous content may be 2- 50ppm. In this method, oxidation of solder base may be prevented, the amount of intermetallic compound included between the joining face and the metal to be joined when joining may be restrained to a minimum, and drop of joining characteristics may be lessened.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14984478A JPS5575893A (en) | 1978-12-04 | 1978-12-04 | Production of solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14984478A JPS5575893A (en) | 1978-12-04 | 1978-12-04 | Production of solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5575893A true JPS5575893A (en) | 1980-06-07 |
Family
ID=15483882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14984478A Pending JPS5575893A (en) | 1978-12-04 | 1978-12-04 | Production of solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5575893A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0168674A1 (en) * | 1984-06-28 | 1986-01-22 | Angelo Passini | Tin base alloy for soldering, having high resistance to the oxidation in the molten state |
WO2003059564A1 (en) | 2002-01-10 | 2003-07-24 | Senju Metal Industry Co., Ltd. | Soldering method and solder alloy for additional supply |
JP2005001000A (en) * | 2003-06-13 | 2005-01-06 | Senju Metal Ind Co Ltd | Method for increasing effectiveness of material component |
JP2015000425A (en) * | 2013-06-18 | 2015-01-05 | 住友金属鉱山株式会社 | Pb-BASED SOLDER ALLOY |
-
1978
- 1978-12-04 JP JP14984478A patent/JPS5575893A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0168674A1 (en) * | 1984-06-28 | 1986-01-22 | Angelo Passini | Tin base alloy for soldering, having high resistance to the oxidation in the molten state |
WO2003059564A1 (en) | 2002-01-10 | 2003-07-24 | Senju Metal Industry Co., Ltd. | Soldering method and solder alloy for additional supply |
US7628308B2 (en) | 2002-01-10 | 2009-12-08 | Senju Metal Industry Co., Ltd. | Method of replenishing an oxidation suppressing element in a solder bath |
JP2005001000A (en) * | 2003-06-13 | 2005-01-06 | Senju Metal Ind Co Ltd | Method for increasing effectiveness of material component |
JP4525192B2 (en) * | 2003-06-13 | 2010-08-18 | 千住金属工業株式会社 | How to increase the effectiveness of material components |
JP2015000425A (en) * | 2013-06-18 | 2015-01-05 | 住友金属鉱山株式会社 | Pb-BASED SOLDER ALLOY |
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