JPS5574848A - Method of providing hole in synthetic resin mold product - Google Patents
Method of providing hole in synthetic resin mold productInfo
- Publication number
- JPS5574848A JPS5574848A JP14985378A JP14985378A JPS5574848A JP S5574848 A JPS5574848 A JP S5574848A JP 14985378 A JP14985378 A JP 14985378A JP 14985378 A JP14985378 A JP 14985378A JP S5574848 A JPS5574848 A JP S5574848A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- pin
- synthetic resin
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To provide hole in synthetic resin molded product without adversely affecting its uniformity and strength of the product itself in such a way that a hole forming pin is pressed into synthetic resin after the resin is filled in a mold cavity, and the pin is drawn out of the mold after the resin has been cured.
CONSTITUTION: An aperture forming pin 6 slidingly inserted into a hole 5 of upper mold 2 is so positioned that its inner end is located at a preferably same plane as the inner wall face of the upper mold 2, and thereafter synthetic resin 10 is filled in a cavity 4. Prior to complete curing of resin 10, the pin 6 is pressed into the cavity 4 upto desired depth of the resin 10 by means of cylinder device 7. When the resin 10 is completely cured, the pin 6 is drawn out of the mold 2 by means of the cylinder device 7, and then the mold goods 11 is separated from lower mold 3 after lifting the upper mold 2. It is preferable to coat inner wall faces of the molds 2 and 3 as well as outer periphery of the pin 6 with any suitable mold parting agent so that desired aperture 12 can be made in the molded goods 11 without adversely affecting to the fluidability of the resin 10 and reinforcement fibers within the resin 10, and also to the strength of the mold goods 11.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14985378A JPS5574848A (en) | 1978-12-04 | 1978-12-04 | Method of providing hole in synthetic resin mold product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14985378A JPS5574848A (en) | 1978-12-04 | 1978-12-04 | Method of providing hole in synthetic resin mold product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5574848A true JPS5574848A (en) | 1980-06-05 |
Family
ID=15484071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14985378A Pending JPS5574848A (en) | 1978-12-04 | 1978-12-04 | Method of providing hole in synthetic resin mold product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5574848A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS569393A (en) * | 1970-03-12 | 1981-01-30 | Gen Electric | Coating of resin substance to electroconductive substrate |
| JPH0489314U (en) * | 1990-08-10 | 1992-08-04 | ||
| JP2016182713A (en) * | 2015-03-26 | 2016-10-20 | 株式会社ファルテック | Resin molding die and resin molding method |
-
1978
- 1978-12-04 JP JP14985378A patent/JPS5574848A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS569393A (en) * | 1970-03-12 | 1981-01-30 | Gen Electric | Coating of resin substance to electroconductive substrate |
| JPH0489314U (en) * | 1990-08-10 | 1992-08-04 | ||
| JP2016182713A (en) * | 2015-03-26 | 2016-10-20 | 株式会社ファルテック | Resin molding die and resin molding method |
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