JPS5574537A - Photosensitive polyamide resin composition - Google Patents

Photosensitive polyamide resin composition

Info

Publication number
JPS5574537A
JPS5574537A JP14783378A JP14783378A JPS5574537A JP S5574537 A JPS5574537 A JP S5574537A JP 14783378 A JP14783378 A JP 14783378A JP 14783378 A JP14783378 A JP 14783378A JP S5574537 A JPS5574537 A JP S5574537A
Authority
JP
Japan
Prior art keywords
resin composition
photo
polymerizable unsaturated
unsaturated compound
polyether segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14783378A
Other languages
Japanese (ja)
Other versions
JPS5718173B2 (en
Inventor
Kazumasa Chiba
Keiichi Egawa
Toshio Muraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP14783378A priority Critical patent/JPS5574537A/en
Priority to DE7979901613T priority patent/DE2967026D1/en
Priority to PCT/JP1979/000307 priority patent/WO1980001212A1/en
Publication of JPS5574537A publication Critical patent/JPS5574537A/en
Priority to EP79901613A priority patent/EP0020782B1/en
Priority to US06/202,381 priority patent/US4323639A/en
Publication of JPS5718173B2 publication Critical patent/JPS5718173B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE:To improve performances such as faster water developing speed and faithful reproduction of fine lines and small spots etc. by making combined use of the copolymerized polyamide containing the specific amount of the polyether segment portions of the specific molecular weights and a photo-polymerizable unsaturated compound. CONSTITUTION:The polyoxy ethylene which has amino groups or carboxyl groups at the terminal and which is of 150-1500 in number average molecular weight of the polyether segment portions, the copolymerized polyamide which contains 30- 70wt% of the constituting units composed of aliphatic dicarboxylic acid or diamine and whose value of O/N is within a range of 1-4 and a photo-polymerizable unsaturated compound (acrylic ester of glycol, etc.) are combined at 5-200wt% based on the weight of the polyamide, and besides these, a photosensitizer, heat polymerization inhibitor are added to produce the photosensitive resin composition. In this way, the printing plate or the like which is of good transparency, soft, tough and highly accurate is obtained.
JP14783378A 1978-12-01 1978-12-01 Photosensitive polyamide resin composition Granted JPS5574537A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP14783378A JPS5574537A (en) 1978-12-01 1978-12-01 Photosensitive polyamide resin composition
DE7979901613T DE2967026D1 (en) 1978-12-01 1979-11-30 Light-sensitive polyamide resin composition
PCT/JP1979/000307 WO1980001212A1 (en) 1978-12-01 1979-11-30 Light-sensitive polyamide resin composition
EP79901613A EP0020782B1 (en) 1978-12-01 1980-06-17 Light-sensitive polyamide resin composition
US06/202,381 US4323639A (en) 1978-12-01 1980-07-24 Photosensitive polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14783378A JPS5574537A (en) 1978-12-01 1978-12-01 Photosensitive polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS5574537A true JPS5574537A (en) 1980-06-05
JPS5718173B2 JPS5718173B2 (en) 1982-04-15

Family

ID=15439269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14783378A Granted JPS5574537A (en) 1978-12-01 1978-12-01 Photosensitive polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS5574537A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58117537A (en) * 1982-01-06 1983-07-13 Toray Ind Inc Photosensitive resin composition
JPS59119345A (en) * 1982-12-24 1984-07-10 Toyobo Co Ltd Photosensitive resin original plate
WO2013035535A1 (en) 2011-09-09 2013-03-14 東洋紡株式会社 Flexographic printing original plate and water-developable photosensitive resin laminate
JP2020013066A (en) * 2018-07-20 2020-01-23 東洋紡株式会社 Photosensitive ctp flexographic printing plate precursor
EP3656576A1 (en) 2015-01-29 2020-05-27 Fujifilm Corporation Lithographic printing plate precursor and method of producing same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2235927B (en) * 1989-09-14 1992-10-21 Asahi Chemical Ind A sulfonic acid group-containing polyurethane and a photosensitive resin composition containing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58117537A (en) * 1982-01-06 1983-07-13 Toray Ind Inc Photosensitive resin composition
JPS59119345A (en) * 1982-12-24 1984-07-10 Toyobo Co Ltd Photosensitive resin original plate
JPH039456B2 (en) * 1982-12-24 1991-02-08 Toyo Boseki
WO2013035535A1 (en) 2011-09-09 2013-03-14 東洋紡株式会社 Flexographic printing original plate and water-developable photosensitive resin laminate
EP3656576A1 (en) 2015-01-29 2020-05-27 Fujifilm Corporation Lithographic printing plate precursor and method of producing same
JP2020013066A (en) * 2018-07-20 2020-01-23 東洋紡株式会社 Photosensitive ctp flexographic printing plate precursor

Also Published As

Publication number Publication date
JPS5718173B2 (en) 1982-04-15

Similar Documents

Publication Publication Date Title
GB1508315A (en) Photosensitive composition
GB1451251A (en) Production of relief printing plates for flexographic printing and presensitized plates for the manufacture of such plates
ATE27471T1 (en) PLIABLE LAMINATE.
SE8200130L (en) POLYMER COMPOSITION WITH TERMINAL ALKENE AND TERMINAL CARBOXYL GROUPS
JPS5574537A (en) Photosensitive polyamide resin composition
JPS5790017A (en) Production of polyether-ester-amide
JPS5785051A (en) Water-soluble photosensitive material
JPS5367792A (en) Oil-modified alkyd resin composition
JPS56100817A (en) Photosetting resin composition
GB1425233A (en) Photopolymerisabel compositions
JPS57170929A (en) Photosensitive polymeric composition
JPS5346391A (en) Preparation of dispersed resin compositon
JPS532587A (en) Preparation of curable polymer
JPS5523143A (en) Cold-setting resin composition
JPS5757720A (en) Roduction of copolyamide resin
JPS5579438A (en) Photosensitive polyamide resin composition
JPS5365352A (en) Composition for finishing and processing of resin
JPS5655941A (en) Photosensitive material
JPS55116750A (en) Water-dispersible resin
JPS565861A (en) Varnish composition for insulating treatment
JPS5738803A (en) Ultraviolet-curable resin composition having excellent pigment dispersibility and adhesiveness
JPS5546749A (en) Composition of photosensitive polymer
JPS5718715A (en) Emulsion composition containing polar resin
JPS57155215A (en) Water-dispersible resin composition
JPS56161538A (en) Photosensitive composition