JPS5565355A - Nonelectrolytic copper deposition having rapid plating velocity - Google Patents

Nonelectrolytic copper deposition having rapid plating velocity

Info

Publication number
JPS5565355A
JPS5565355A JP11865179A JP11865179A JPS5565355A JP S5565355 A JPS5565355 A JP S5565355A JP 11865179 A JP11865179 A JP 11865179A JP 11865179 A JP11865179 A JP 11865179A JP S5565355 A JPS5565355 A JP S5565355A
Authority
JP
Japan
Prior art keywords
copper deposition
rapid plating
nonelectrolytic copper
plating velocity
velocity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11865179A
Other languages
Japanese (ja)
Other versions
JPS5927379B2 (en
Inventor
Efu Matsukoomatsuku Jiyon
Jiei Natsuchi Furanshisu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS5565355A publication Critical patent/JPS5565355A/en
Publication of JPS5927379B2 publication Critical patent/JPS5927379B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
JP54118651A 1978-09-13 1979-09-13 Electroless copper deposition method with rapid plating speed Expired JPS5927379B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94191278A 1978-09-13 1978-09-13
US000000941912 1978-09-13

Publications (2)

Publication Number Publication Date
JPS5565355A true JPS5565355A (en) 1980-05-16
JPS5927379B2 JPS5927379B2 (en) 1984-07-05

Family

ID=25477278

Family Applications (2)

Application Number Title Priority Date Filing Date
JP54118651A Expired JPS5927379B2 (en) 1978-09-13 1979-09-13 Electroless copper deposition method with rapid plating speed
JP58112590A Expired JPS5915981B2 (en) 1978-09-13 1983-06-21 Electroless copper deposition method with rapid plating speed

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP58112590A Expired JPS5915981B2 (en) 1978-09-13 1983-06-21 Electroless copper deposition method with rapid plating speed

Country Status (17)

Country Link
JP (2) JPS5927379B2 (en)
AT (1) AT366105B (en)
AU (1) AU532144B2 (en)
BR (1) BR7905066A (en)
CA (1) CA1135903A (en)
CH (1) CH646200A5 (en)
DE (1) DE2937297C2 (en)
DK (1) DK148920C (en)
ES (1) ES484158A1 (en)
FR (1) FR2436192A1 (en)
GB (1) GB2032462B (en)
IL (1) IL58202A (en)
IT (1) IT1162420B (en)
MX (1) MX152657A (en)
NL (1) NL189523C (en)
SE (1) SE7907531L (en)
ZA (1) ZA793786B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241188A (en) * 1986-11-14 1988-10-06 Nippon Denso Co Ltd Chemical copper plating solution
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JPH036383A (en) * 1989-06-02 1991-01-11 Nippondenso Co Ltd Chemical copper plating solution
JP2013095956A (en) * 2011-10-31 2013-05-20 Shinko Electric Ind Co Ltd Electroless copper plating bath

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8005024A (en) * 1980-09-05 1982-04-01 Philips Nv METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
DE3585017D1 (en) * 1984-09-27 1992-02-06 Toshiba Kawasaki Kk CURRENT COPPER PLATING SOLUTION.
ES2039403T3 (en) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.
JPH0723539B2 (en) * 1986-11-06 1995-03-15 日本電装株式会社 Chemical copper plating solution and method for forming copper plating film using the same
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (en) * 1988-07-20 1997-04-02 日本電装株式会社 Chemical copper plating solution and method for forming copper plating film using the same
JPH0448100A (en) * 1990-06-15 1992-02-18 Nkk Corp Washing equipment
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP5255015B2 (en) * 2010-04-28 2013-08-07 名古屋メッキ工業株式会社 Electroless copper plating method for polymer fiber
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN113881984B (en) * 2021-10-21 2022-09-16 深圳市励高表面处理材料有限公司 Pulse electroplating leveling agent, preparation method and electroplating solution applying leveling solution

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
CH491206A (en) * 1966-02-01 1970-05-31 Photocircuits Corp Bath solution for electroless deposition of metal layers
US3720525A (en) * 1971-08-16 1973-03-13 Rca Corp Electroless copper plating solutions with accelerated plating rates
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
JPS5173933A (en) * 1974-12-25 1976-06-26 Mitsubishi Rayon Co MUDENKAIDOMETSUKYOKU
JPS5746448B2 (en) * 1975-03-14 1982-10-04
JPS5288227A (en) * 1976-01-19 1977-07-23 Hitachi Ltd Chemical copper plating solution
IT1059950B (en) * 1976-04-30 1982-06-21 Alfachimici Spa COMPOSITION FOR AUTOCATALYTIC ANELECTRIC COPPERING
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241188A (en) * 1986-11-14 1988-10-06 Nippon Denso Co Ltd Chemical copper plating solution
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JPH036383A (en) * 1989-06-02 1991-01-11 Nippondenso Co Ltd Chemical copper plating solution
JP2013095956A (en) * 2011-10-31 2013-05-20 Shinko Electric Ind Co Ltd Electroless copper plating bath

Also Published As

Publication number Publication date
NL7906856A (en) 1980-03-17
AU4956779A (en) 1980-03-20
ATA600879A (en) 1981-07-15
IT1162420B (en) 1987-04-01
ZA793786B (en) 1980-07-30
SE7907531L (en) 1980-03-14
ES484158A1 (en) 1980-09-01
DE2937297C2 (en) 1982-04-08
IT7950227A0 (en) 1979-09-11
FR2436192A1 (en) 1980-04-11
IL58202A (en) 1982-08-31
JPS5915981B2 (en) 1984-04-12
DK148920B (en) 1985-11-18
GB2032462B (en) 1983-05-18
AU532144B2 (en) 1983-09-22
DK381979A (en) 1980-03-14
BR7905066A (en) 1980-04-29
CH646200A5 (en) 1984-11-15
DK148920C (en) 1986-05-05
JPS5925965A (en) 1984-02-10
FR2436192B1 (en) 1983-08-26
NL189523C (en) 1993-05-03
AT366105B (en) 1982-03-10
GB2032462A (en) 1980-05-08
JPS5927379B2 (en) 1984-07-05
MX152657A (en) 1985-10-07
IL58202A0 (en) 1979-12-30
CA1135903A (en) 1982-11-23
DE2937297A1 (en) 1980-03-20

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