JPS5562799A - Method of manufacturing thick film multilayer board - Google Patents

Method of manufacturing thick film multilayer board

Info

Publication number
JPS5562799A
JPS5562799A JP13527278A JP13527278A JPS5562799A JP S5562799 A JPS5562799 A JP S5562799A JP 13527278 A JP13527278 A JP 13527278A JP 13527278 A JP13527278 A JP 13527278A JP S5562799 A JPS5562799 A JP S5562799A
Authority
JP
Japan
Prior art keywords
thick film
multilayer board
film multilayer
manufacturing thick
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13527278A
Other languages
Japanese (ja)
Inventor
Takahiro Suzuki
Toshinori Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Electric Manufacturing Co Ltd
Priority to JP13527278A priority Critical patent/JPS5562799A/en
Publication of JPS5562799A publication Critical patent/JPS5562799A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP13527278A 1978-11-02 1978-11-02 Method of manufacturing thick film multilayer board Pending JPS5562799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13527278A JPS5562799A (en) 1978-11-02 1978-11-02 Method of manufacturing thick film multilayer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13527278A JPS5562799A (en) 1978-11-02 1978-11-02 Method of manufacturing thick film multilayer board

Publications (1)

Publication Number Publication Date
JPS5562799A true JPS5562799A (en) 1980-05-12

Family

ID=15147816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13527278A Pending JPS5562799A (en) 1978-11-02 1978-11-02 Method of manufacturing thick film multilayer board

Country Status (1)

Country Link
JP (1) JPS5562799A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359489A (en) * 1991-06-05 1992-12-11 Mitsuba Electric Mfg Co Ltd Method of manufacturing circuit substrate
US7146719B2 (en) 2000-06-15 2006-12-12 Murata Manufacturing Co., Ltd. Multilayer circuit component and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5256923U (en) * 1975-10-22 1977-04-25
JPS52115364A (en) * 1976-03-24 1977-09-27 Hitachi Ltd Coating for thick film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5256923U (en) * 1975-10-22 1977-04-25
JPS52115364A (en) * 1976-03-24 1977-09-27 Hitachi Ltd Coating for thick film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359489A (en) * 1991-06-05 1992-12-11 Mitsuba Electric Mfg Co Ltd Method of manufacturing circuit substrate
US7146719B2 (en) 2000-06-15 2006-12-12 Murata Manufacturing Co., Ltd. Multilayer circuit component and method for manufacturing the same

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