JPS556066A - Production of fluid passage - Google Patents
Production of fluid passageInfo
- Publication number
- JPS556066A JPS556066A JP7933878A JP7933878A JPS556066A JP S556066 A JPS556066 A JP S556066A JP 7933878 A JP7933878 A JP 7933878A JP 7933878 A JP7933878 A JP 7933878A JP S556066 A JPS556066 A JP S556066A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- fluid passages
- resist
- photo
- passages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To form small fluid passages at low cost by embedding an element which can be etched by a specified etching means and etching the element. CONSTITUTION:An upper cover 26 made of titanium is prepared (a). A photo- resist 30 is applied on the cover 26 and exposure and development are conducted to form a desired pattern (b). Copper 31 is plated at the portions where fluid passages 25 are to be formed (c). The photo-resist 30 is removed (d). A main body is molded by use of a mold and water glass 32 represented by the formula Na2SiO4- 4H2O or the like (e). The copper 31 is etched away by use of ferric chloride (f). Because the copper 31 is placed where the fluid passages 25 are to be formed before the surrounding is formed, such troubles as clogging by coming out of an adhesive or the like into the passages 25 can be obviated and yield and reliability are enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7933878A JPS556066A (en) | 1978-06-29 | 1978-06-29 | Production of fluid passage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7933878A JPS556066A (en) | 1978-06-29 | 1978-06-29 | Production of fluid passage |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS556066A true JPS556066A (en) | 1980-01-17 |
JPS6115155B2 JPS6115155B2 (en) | 1986-04-22 |
Family
ID=13687106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7933878A Granted JPS556066A (en) | 1978-06-29 | 1978-06-29 | Production of fluid passage |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS556066A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02133340U (en) * | 1988-12-16 | 1990-11-06 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822072A (en) * | 1971-07-23 | 1973-03-20 |
-
1978
- 1978-06-29 JP JP7933878A patent/JPS556066A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822072A (en) * | 1971-07-23 | 1973-03-20 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02133340U (en) * | 1988-12-16 | 1990-11-06 |
Also Published As
Publication number | Publication date |
---|---|
JPS6115155B2 (en) | 1986-04-22 |
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