JPS5560509A - Highly radiation-sensitive composition and its solution - Google Patents
Highly radiation-sensitive composition and its solutionInfo
- Publication number
- JPS5560509A JPS5560509A JP13292178A JP13292178A JPS5560509A JP S5560509 A JPS5560509 A JP S5560509A JP 13292178 A JP13292178 A JP 13292178A JP 13292178 A JP13292178 A JP 13292178A JP S5560509 A JPS5560509 A JP S5560509A
- Authority
- JP
- Japan
- Prior art keywords
- materials
- give
- sensitive composition
- solution
- propyl methacrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: To prepare a highly radiation-sensitive composition useful as materials for positive resists, etc. and having improved heat resistance, solvent resistance and etching resistance, by copolymerizing i-propyl methacrylate with a specific ester of an acrylic acid derivative.
CONSTITUTION: (A) i-Propyl methacrylate monomer is copolymerized as a main component with (B) a monomer expressed by the formula (R1 is -CN, -F, -Cl, etc.; R2 is i-propyl) in the presence of a radical polymerization catalyst to give the desired composition. The preferable content of the component (B) is 1W45mole%. The polymer composition is dissolved in a volatile solvent having improved film formability and spreadability and a low viscosity (e.g. toluene, etc.) to give a solution useful for preparation of materials for positive resists.
USE: Resist materials in the production process of semiconductor elements, information-recording materials, etc.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13292178A JPS5560509A (en) | 1978-10-27 | 1978-10-27 | Highly radiation-sensitive composition and its solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13292178A JPS5560509A (en) | 1978-10-27 | 1978-10-27 | Highly radiation-sensitive composition and its solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5560509A true JPS5560509A (en) | 1980-05-07 |
Family
ID=15092617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13292178A Pending JPS5560509A (en) | 1978-10-27 | 1978-10-27 | Highly radiation-sensitive composition and its solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5560509A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58113933A (en) * | 1981-12-26 | 1983-07-07 | Daikin Ind Ltd | Resist material and formation of resist micropattern using it |
| EP1795960A3 (en) * | 2005-12-09 | 2008-06-25 | Fujifilm Corporation | Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition |
-
1978
- 1978-10-27 JP JP13292178A patent/JPS5560509A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58113933A (en) * | 1981-12-26 | 1983-07-07 | Daikin Ind Ltd | Resist material and formation of resist micropattern using it |
| JPH0358104B2 (en) * | 1981-12-26 | 1991-09-04 | Daikin Kogyo Kk | |
| EP1795960A3 (en) * | 2005-12-09 | 2008-06-25 | Fujifilm Corporation | Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition |
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