JPS5559921A - Method of gluing polyolefin molding - Google Patents
Method of gluing polyolefin moldingInfo
- Publication number
- JPS5559921A JPS5559921A JP13258378A JP13258378A JPS5559921A JP S5559921 A JPS5559921 A JP S5559921A JP 13258378 A JP13258378 A JP 13258378A JP 13258378 A JP13258378 A JP 13258378A JP S5559921 A JPS5559921 A JP S5559921A
- Authority
- JP
- Japan
- Prior art keywords
- moldings
- gluing
- polyolefin molding
- vinyl acetate
- ethylene vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To obtain a double-layer material useful for residential interior decoration or the like by intensely gluing a polyolefin molding on a polyolefin molding or other moldings through a high frequency induction heating with a film made of an ethylene vinyl acetate copolymer and the like placed on the intended surface without damaging the appearance and physical properties.
CONSTITUTION: When two moldings at least one being a polyolefin molding are glued together, a gluing is made through a high frequency induction heating with a film mainly composed of an ethylene vinyl acetate placed on the intended surface to produce a double-layer material. The applying moldings are films, sheets or plate- shaped materials while the base moldings are vinyl chloride, polyurethane or the like. The thickness of the ethylene vinyl acetate copolymer preferably ranges from 20W50μ.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13258378A JPS5559921A (en) | 1978-10-30 | 1978-10-30 | Method of gluing polyolefin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13258378A JPS5559921A (en) | 1978-10-30 | 1978-10-30 | Method of gluing polyolefin molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5559921A true JPS5559921A (en) | 1980-05-06 |
Family
ID=15084720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13258378A Pending JPS5559921A (en) | 1978-10-30 | 1978-10-30 | Method of gluing polyolefin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5559921A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57199435U (en) * | 1981-06-12 | 1982-12-18 | ||
WO2018147351A1 (en) * | 2017-02-09 | 2018-08-16 | リンテック株式会社 | Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film |
CN109890923A (en) * | 2016-10-27 | 2019-06-14 | 琳得科株式会社 | Dielectric heating adhesive film and the adhering method for having used dielectric heating adhesive film |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501901A (en) * | 1973-03-23 | 1975-01-10 |
-
1978
- 1978-10-30 JP JP13258378A patent/JPS5559921A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501901A (en) * | 1973-03-23 | 1975-01-10 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57199435U (en) * | 1981-06-12 | 1982-12-18 | ||
JPS6140520Y2 (en) * | 1981-06-12 | 1986-11-19 | ||
CN109890923A (en) * | 2016-10-27 | 2019-06-14 | 琳得科株式会社 | Dielectric heating adhesive film and the adhering method for having used dielectric heating adhesive film |
CN109890923B (en) * | 2016-10-27 | 2022-05-17 | 琳得科株式会社 | Dielectric heating adhesive film and adhesive method using dielectric heating adhesive film |
US11541607B2 (en) | 2016-10-27 | 2023-01-03 | Lintec Corporation | Dielectric-heating bonding film and bonding method using dielectric-heating bonding film |
WO2018147351A1 (en) * | 2017-02-09 | 2018-08-16 | リンテック株式会社 | Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film |
JPWO2018147351A1 (en) * | 2017-02-09 | 2019-11-07 | リンテック株式会社 | Dielectric heating adhesive film and bonding method using dielectric heating adhesive film |
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