JPS5556682A - Method of and device for coating solder on printed circuit board - Google Patents

Method of and device for coating solder on printed circuit board

Info

Publication number
JPS5556682A
JPS5556682A JP12925778A JP12925778A JPS5556682A JP S5556682 A JPS5556682 A JP S5556682A JP 12925778 A JP12925778 A JP 12925778A JP 12925778 A JP12925778 A JP 12925778A JP S5556682 A JPS5556682 A JP S5556682A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
coating solder
solder
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12925778A
Other languages
Japanese (ja)
Inventor
Mitsuo Yamaguchi
Hiroshi Nagatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP12925778A priority Critical patent/JPS5556682A/en
Publication of JPS5556682A publication Critical patent/JPS5556682A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP12925778A 1978-10-20 1978-10-20 Method of and device for coating solder on printed circuit board Pending JPS5556682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12925778A JPS5556682A (en) 1978-10-20 1978-10-20 Method of and device for coating solder on printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12925778A JPS5556682A (en) 1978-10-20 1978-10-20 Method of and device for coating solder on printed circuit board

Publications (1)

Publication Number Publication Date
JPS5556682A true JPS5556682A (en) 1980-04-25

Family

ID=15005083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12925778A Pending JPS5556682A (en) 1978-10-20 1978-10-20 Method of and device for coating solder on printed circuit board

Country Status (1)

Country Link
JP (1) JPS5556682A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045965A (en) * 1973-08-14 1975-04-24
JPS5122067A (en) * 1974-08-19 1976-02-21 Fujitsu Ltd Purintohaisenbanno metsukiatoshorihoho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045965A (en) * 1973-08-14 1975-04-24
JPS5122067A (en) * 1974-08-19 1976-02-21 Fujitsu Ltd Purintohaisenbanno metsukiatoshorihoho

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