JPS5548216A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5548216A JPS5548216A JP12222778A JP12222778A JPS5548216A JP S5548216 A JPS5548216 A JP S5548216A JP 12222778 A JP12222778 A JP 12222778A JP 12222778 A JP12222778 A JP 12222778A JP S5548216 A JPS5548216 A JP S5548216A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- vinylphenol
- incorporating
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To obtain an epoxy resin composition of good curing cbaracteristics, capable of affording cured products having excellent heat resistance leading to usefulness as heat-resistant adhesives, etc., by incorporating an epoxy resin with a curing agent consisting of an aromatic amine and poly-p-vinylphenol.
CONSTITUTION: The objective composition can be obtained by incorporating (A) an epoxy resin (e.g., bisphenol-A diglycidyl ether) with (B) a curing agent consisting of a) an aromatic amine and b) poly-p-vinylphenol in the form of a solution of methylethyl ketone, etc. Said component a) is, e.g., a dihalogenated diaminodiphenylmethane, diaminodiphenylsulfone. The component b) is desired to have an average molecular wiegth of 3,000W10,000 and a hydroxyl equivalent of about 120.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53122227A JPS5818929B2 (en) | 1978-10-03 | 1978-10-03 | epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53122227A JPS5818929B2 (en) | 1978-10-03 | 1978-10-03 | epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5548216A true JPS5548216A (en) | 1980-04-05 |
JPS5818929B2 JPS5818929B2 (en) | 1983-04-15 |
Family
ID=14830706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53122227A Expired JPS5818929B2 (en) | 1978-10-03 | 1978-10-03 | epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5818929B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3117960A1 (en) * | 1980-05-10 | 1982-03-25 | Matsushita Electric Works Ltd., Kadoma, Osaka | EPOXY RESIN COMPOSITION |
JP2015070024A (en) * | 2013-09-27 | 2015-04-13 | 京セラケミカル株式会社 | Resin composition for thermistor sensor casting use, and thermistor sensor |
-
1978
- 1978-10-03 JP JP53122227A patent/JPS5818929B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3117960A1 (en) * | 1980-05-10 | 1982-03-25 | Matsushita Electric Works Ltd., Kadoma, Osaka | EPOXY RESIN COMPOSITION |
US4399257A (en) * | 1980-05-10 | 1983-08-16 | Matsushita Electric Works, Ltd. | Epoxy resin composition |
JP2015070024A (en) * | 2013-09-27 | 2015-04-13 | 京セラケミカル株式会社 | Resin composition for thermistor sensor casting use, and thermistor sensor |
Also Published As
Publication number | Publication date |
---|---|
JPS5818929B2 (en) | 1983-04-15 |
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