JPS5544747A - Manufacture of dielectric substrate - Google Patents

Manufacture of dielectric substrate

Info

Publication number
JPS5544747A
JPS5544747A JP11820078A JP11820078A JPS5544747A JP S5544747 A JPS5544747 A JP S5544747A JP 11820078 A JP11820078 A JP 11820078A JP 11820078 A JP11820078 A JP 11820078A JP S5544747 A JPS5544747 A JP S5544747A
Authority
JP
Japan
Prior art keywords
holes
sheet
blocks
substrate
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11820078A
Other languages
Japanese (ja)
Inventor
Masayuki Ishizaki
Hiroyuki Hachitsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11820078A priority Critical patent/JPS5544747A/en
Publication of JPS5544747A publication Critical patent/JPS5544747A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE: To easily form holes with the desired shape at arbitrary locations, by making up the holes to a green sheet by means of a jig, by buring the sheet, by inserting metallic blocks into the holes and by sticking the sheet fast to a substrate by means of press.
CONSTITUTION: A green sheet GS is built up, holes P with the desired shape are formed at the arbitrary locations by employing a jig, the sheet GS is fired, the metallic blocks 2 of copper, aluminum, etc. are inserted into the holes P of a substrate 1, the blocks 2 are welded to the substrate 1 by means of press and the projecting blocks 2 are removed by means of an edge tool 7. The holes with the desired form can easily be made up at arbitrary positions by working the holes in a green sheet stage.
COPYRIGHT: (C)1980,JPO&Japio
JP11820078A 1978-09-26 1978-09-26 Manufacture of dielectric substrate Pending JPS5544747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11820078A JPS5544747A (en) 1978-09-26 1978-09-26 Manufacture of dielectric substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11820078A JPS5544747A (en) 1978-09-26 1978-09-26 Manufacture of dielectric substrate

Publications (1)

Publication Number Publication Date
JPS5544747A true JPS5544747A (en) 1980-03-29

Family

ID=14730650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11820078A Pending JPS5544747A (en) 1978-09-26 1978-09-26 Manufacture of dielectric substrate

Country Status (1)

Country Link
JP (1) JPS5544747A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123290A (en) * 1982-12-28 1984-07-17 松下電器産業株式会社 Printed board
JPS62245492A (en) * 1986-04-18 1987-10-26 Fujitsu Ltd Embossing reader
WO1989008374A1 (en) * 1988-02-26 1989-09-08 Fujitsu Limited Substrate for mounting optical parts and electric circuitry parts and method of producing the same
US5456004A (en) * 1994-01-04 1995-10-10 Dell Usa, L.P. Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
JPH0795619B1 (en) * 1988-02-26 1995-10-11 Fujitsu Ltd
JP2010205995A (en) * 2009-03-04 2010-09-16 Hitachi Kokusai Electric Inc Printed board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123290A (en) * 1982-12-28 1984-07-17 松下電器産業株式会社 Printed board
JPS62245492A (en) * 1986-04-18 1987-10-26 Fujitsu Ltd Embossing reader
WO1989008374A1 (en) * 1988-02-26 1989-09-08 Fujitsu Limited Substrate for mounting optical parts and electric circuitry parts and method of producing the same
JPH0795619B1 (en) * 1988-02-26 1995-10-11 Fujitsu Ltd
US5456004A (en) * 1994-01-04 1995-10-10 Dell Usa, L.P. Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
JP2010205995A (en) * 2009-03-04 2010-09-16 Hitachi Kokusai Electric Inc Printed board

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