JPS5544746A - Manufacture of integrated circuit - Google Patents
Manufacture of integrated circuitInfo
- Publication number
- JPS5544746A JPS5544746A JP11819978A JP11819978A JPS5544746A JP S5544746 A JPS5544746 A JP S5544746A JP 11819978 A JP11819978 A JP 11819978A JP 11819978 A JP11819978 A JP 11819978A JP S5544746 A JPS5544746 A JP S5544746A
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- oxidized
- integrated circuit
- polycrystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Element Separation (AREA)
Abstract
PURPOSE: To improve the yeild and reliability of this integrated circuit, by bettering isolation insulation among elements by forming a polycrystal Si portion on a Si oxidized insulating film and by putting an oxidized Al film between the insulating film and the Si portion.
CONSTITUTION: A Si oxide film 14 is formed on a surface of an N-type Si epitaxial layer 12 laminated on an upper surface of a P-type Si substrate 11, an upper portion of the film 14 is coated with a nitrated Si film 10, a window is opened to the film 10, a V-shaped groove is made up by means of etching by a NaOH solution and a Si oxidized insulating film 13 is created to the inside. A polycrystal Si portion 16 is built up on the insulating film 13, and an oxidized Al film 15 is placed between the insulating film 13 and the Si portion 16. Thus, the yield and reliability of this integrated circuit can be advanced because isolation insulation among elements is made better.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11819978A JPS5544746A (en) | 1978-09-26 | 1978-09-26 | Manufacture of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11819978A JPS5544746A (en) | 1978-09-26 | 1978-09-26 | Manufacture of integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5544746A true JPS5544746A (en) | 1980-03-29 |
Family
ID=14730623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11819978A Pending JPS5544746A (en) | 1978-09-26 | 1978-09-26 | Manufacture of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5544746A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4611386A (en) * | 1982-12-27 | 1986-09-16 | Fujitsu Limited | Method of producing a semiconductor device |
JPH06196551A (en) * | 1992-09-04 | 1994-07-15 | Internatl Business Mach Corp <Ibm> | Flattening of recessed part surface of semiconductor structure |
-
1978
- 1978-09-26 JP JP11819978A patent/JPS5544746A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4611386A (en) * | 1982-12-27 | 1986-09-16 | Fujitsu Limited | Method of producing a semiconductor device |
JPH06196551A (en) * | 1992-09-04 | 1994-07-15 | Internatl Business Mach Corp <Ibm> | Flattening of recessed part surface of semiconductor structure |
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