JPS5542868A - Method of reusing copper lined laminated plate waste material - Google Patents

Method of reusing copper lined laminated plate waste material

Info

Publication number
JPS5542868A
JPS5542868A JP11719978A JP11719978A JPS5542868A JP S5542868 A JPS5542868 A JP S5542868A JP 11719978 A JP11719978 A JP 11719978A JP 11719978 A JP11719978 A JP 11719978A JP S5542868 A JPS5542868 A JP S5542868A
Authority
JP
Japan
Prior art keywords
waste material
laminated plate
plate waste
copper lined
lined laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11719978A
Other languages
Japanese (ja)
Inventor
Shiyouji Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP11719978A priority Critical patent/JPS5542868A/en
Publication of JPS5542868A publication Critical patent/JPS5542868A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

Landscapes

  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
JP11719978A 1978-09-22 1978-09-22 Method of reusing copper lined laminated plate waste material Pending JPS5542868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11719978A JPS5542868A (en) 1978-09-22 1978-09-22 Method of reusing copper lined laminated plate waste material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11719978A JPS5542868A (en) 1978-09-22 1978-09-22 Method of reusing copper lined laminated plate waste material

Publications (1)

Publication Number Publication Date
JPS5542868A true JPS5542868A (en) 1980-03-26

Family

ID=14705839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11719978A Pending JPS5542868A (en) 1978-09-22 1978-09-22 Method of reusing copper lined laminated plate waste material

Country Status (1)

Country Link
JP (1) JPS5542868A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58145732A (en) * 1982-02-24 1983-08-30 Hitachi Chem Co Ltd Production of laminated paper/phenolic resin sheet
US4696861A (en) * 1983-11-09 1987-09-29 Brother Kogyo Kabushiki Kaisha Substrate processed for electroless plating for printed wiring pattern and process for manufacturing the processed substrate
US4714653A (en) * 1983-10-28 1987-12-22 Rhone-Poulenc Recherches Metallizable substrate composites and printed circuits produced therefrom

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58145732A (en) * 1982-02-24 1983-08-30 Hitachi Chem Co Ltd Production of laminated paper/phenolic resin sheet
JPS6336340B2 (en) * 1982-02-24 1988-07-20 Hitachi Chemical Co Ltd
US4714653A (en) * 1983-10-28 1987-12-22 Rhone-Poulenc Recherches Metallizable substrate composites and printed circuits produced therefrom
US4696861A (en) * 1983-11-09 1987-09-29 Brother Kogyo Kabushiki Kaisha Substrate processed for electroless plating for printed wiring pattern and process for manufacturing the processed substrate

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