JPS5541728A - Pattern formation by thick film paste - Google Patents
Pattern formation by thick film pasteInfo
- Publication number
- JPS5541728A JPS5541728A JP11442178A JP11442178A JPS5541728A JP S5541728 A JPS5541728 A JP S5541728A JP 11442178 A JP11442178 A JP 11442178A JP 11442178 A JP11442178 A JP 11442178A JP S5541728 A JPS5541728 A JP S5541728A
- Authority
- JP
- Japan
- Prior art keywords
- base
- resists
- openings
- thick film
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To form patterns with openings as small as about 100 micrometers by firstly providing resist patterns on a multi-layer thick film base for LSI's to correspond to the openings, then applying a thick film insulating paste to the thus treated base and finally removing the resists to form the desired patterns.
CONSTITUTION: A photosensitive polymeric material 2 having a predetermined thickness is put in contact with a base 1. The photosensitive polymeric material 2 is exposed to light through a prescribed photomask, followed by development with a developing solution, to leave parts of the material 2 corresponding to openings as resists 3. Then an insulating paste 4 is applied over the base 1 in a thickness such that the resists are all covered. Thereupon, the resists 3 are removed together with the paste 4 just overlying each resist. The remaining portions of the paste 4 are dried and burnt to form patterns with openings 5 on the base 1.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11442178A JPS5541728A (en) | 1978-09-18 | 1978-09-18 | Pattern formation by thick film paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11442178A JPS5541728A (en) | 1978-09-18 | 1978-09-18 | Pattern formation by thick film paste |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5541728A true JPS5541728A (en) | 1980-03-24 |
Family
ID=14637280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11442178A Pending JPS5541728A (en) | 1978-09-18 | 1978-09-18 | Pattern formation by thick film paste |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5541728A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4525448A (en) * | 1984-01-06 | 1985-06-25 | International Telephone And Telegraph Corporation | Method of fabricating sub-half-micron-size gates on semiconductor substrates |
US4939071A (en) * | 1984-03-06 | 1990-07-03 | Harris Corporation | Method for forming low resistance, sub-micrometer semiconductor gate structures |
JPH06181616A (en) * | 1992-12-21 | 1994-07-05 | Kobashi Kogyo Co Ltd | Harvester for farm product |
WO2004066364A3 (en) * | 2003-01-22 | 2005-01-20 | Du Pont | Binder diffusion patterning of a thick film paste layer |
-
1978
- 1978-09-18 JP JP11442178A patent/JPS5541728A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4525448A (en) * | 1984-01-06 | 1985-06-25 | International Telephone And Telegraph Corporation | Method of fabricating sub-half-micron-size gates on semiconductor substrates |
US4939071A (en) * | 1984-03-06 | 1990-07-03 | Harris Corporation | Method for forming low resistance, sub-micrometer semiconductor gate structures |
JPH06181616A (en) * | 1992-12-21 | 1994-07-05 | Kobashi Kogyo Co Ltd | Harvester for farm product |
WO2004066364A3 (en) * | 2003-01-22 | 2005-01-20 | Du Pont | Binder diffusion patterning of a thick film paste layer |
US7358037B2 (en) | 2003-01-22 | 2008-04-15 | E.I. Du Pont De Nemours And Company | Binder diffusion transfer patterning of a thick film paste layer |
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