JPS5541705A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5541705A
JPS5541705A JP11379478A JP11379478A JPS5541705A JP S5541705 A JPS5541705 A JP S5541705A JP 11379478 A JP11379478 A JP 11379478A JP 11379478 A JP11379478 A JP 11379478A JP S5541705 A JPS5541705 A JP S5541705A
Authority
JP
Japan
Prior art keywords
studs
disconnection
bonded
mechanical strength
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11379478A
Other languages
Japanese (ja)
Inventor
Osamu Tadano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11379478A priority Critical patent/JPS5541705A/en
Publication of JPS5541705A publication Critical patent/JPS5541705A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To provide a method of protectin disconnection and improving electric contact with increasing the mechanical strength which is achieved by hardenning a conductive paste using released heat when copper is contacted with studs.
CONSTITUTION: Anode bump electrode 4 and cathode electrode 6, are bonded on and under of semiconductor pellet by heating in the condition of holding the pellet with studs 2a and 2b in glass sleeve 1. In this case, conductive paste 7 and 8 closely contact with the copper edge of studs when it is bonded, and the paste becomes hard by released heat. By so doing, the increased mechanical strength protects disconnection of wire and improves electric contact.
COPYRIGHT: (C)1980,JPO&Japio
JP11379478A 1978-09-15 1978-09-15 Semiconductor device Pending JPS5541705A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11379478A JPS5541705A (en) 1978-09-15 1978-09-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11379478A JPS5541705A (en) 1978-09-15 1978-09-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5541705A true JPS5541705A (en) 1980-03-24

Family

ID=14621245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11379478A Pending JPS5541705A (en) 1978-09-15 1978-09-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5541705A (en)

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