JPS5529589U - - Google Patents
Info
- Publication number
- JPS5529589U JPS5529589U JP1978113746U JP11374678U JPS5529589U JP S5529589 U JPS5529589 U JP S5529589U JP 1978113746 U JP1978113746 U JP 1978113746U JP 11374678 U JP11374678 U JP 11374678U JP S5529589 U JPS5529589 U JP S5529589U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978113746U JPS5824446Y2 (ja) | 1978-08-18 | 1978-08-18 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978113746U JPS5824446Y2 (ja) | 1978-08-18 | 1978-08-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5529589U true JPS5529589U (ja) | 1980-02-26 |
| JPS5824446Y2 JPS5824446Y2 (ja) | 1983-05-25 |
Family
ID=29063851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978113746U Expired JPS5824446Y2 (ja) | 1978-08-18 | 1978-08-18 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824446Y2 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59173342U (ja) * | 1983-05-06 | 1984-11-19 | 松下電器産業株式会社 | 半導体素子収納容器 |
| JP2002255167A (ja) * | 2001-02-26 | 2002-09-11 | Murata Mfg Co Ltd | 電子部品パッケージおよびその製造方法 |
| JP2013120762A (ja) * | 2011-12-06 | 2013-06-17 | Seiko Epson Corp | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS537172A (en) * | 1976-07-09 | 1978-01-23 | Hitachi Ltd | Solder-sealed ceramic package |
| JPS5349044U (ja) * | 1976-09-29 | 1978-04-25 |
-
1978
- 1978-08-18 JP JP1978113746U patent/JPS5824446Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS537172A (en) * | 1976-07-09 | 1978-01-23 | Hitachi Ltd | Solder-sealed ceramic package |
| JPS5349044U (ja) * | 1976-09-29 | 1978-04-25 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59173342U (ja) * | 1983-05-06 | 1984-11-19 | 松下電器産業株式会社 | 半導体素子収納容器 |
| JP2002255167A (ja) * | 2001-02-26 | 2002-09-11 | Murata Mfg Co Ltd | 電子部品パッケージおよびその製造方法 |
| JP4710149B2 (ja) * | 2001-02-26 | 2011-06-29 | 株式会社村田製作所 | 電子部品パッケージおよびその製造方法 |
| JP2013120762A (ja) * | 2011-12-06 | 2013-06-17 | Seiko Epson Corp | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5824446Y2 (ja) | 1983-05-25 |