JPS5526672A - Lead frame for semiconductor element - Google Patents
Lead frame for semiconductor elementInfo
- Publication number
- JPS5526672A JPS5526672A JP9970878A JP9970878A JPS5526672A JP S5526672 A JPS5526672 A JP S5526672A JP 9970878 A JP9970878 A JP 9970878A JP 9970878 A JP9970878 A JP 9970878A JP S5526672 A JPS5526672 A JP S5526672A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plate thickness
- lead
- metallic roller
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To permit a formation of a fine internal lead increasing the bending strength of an external lead, by making a plate thickness in a part of a lead frame thicker than the others, in a sheet of the lead frame for mounting a semiconductor element.
CONSTITUTION: In a sheet of lead frame, plate thickness in the vicinity of a semiconductor chip mounting portion of a single lead frame is made thicker than the other portions. In order to effect such a processing, the diameter of a metallic roller is set at two values, a pressing is pefformed by utilizing a metallic roller having a small diameter, and a central region for mounting a chip is pressed by using a metallic roller having a great diameter. According to such a process, the space of the internal lead can be narrow, because the plate thickness in the vicinity of the chip mounting portion is made small, therefore, a fine pattern formation can be established easily. Because the plate thickness is made thicker in the circumferential portions, a bending strength of the external lead can be increased. The molding should be provided from the thin region to the thick region in sealing it by using a mold.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9970878A JPS5526672A (en) | 1978-08-15 | 1978-08-15 | Lead frame for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9970878A JPS5526672A (en) | 1978-08-15 | 1978-08-15 | Lead frame for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5526672A true JPS5526672A (en) | 1980-02-26 |
Family
ID=14254559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9970878A Pending JPS5526672A (en) | 1978-08-15 | 1978-08-15 | Lead frame for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5526672A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4482915A (en) * | 1981-07-06 | 1984-11-13 | Matsushita Electronics Corp. | Lead frame for plastic encapsulated semiconductor device |
| JPS62122254A (en) * | 1985-11-22 | 1987-06-03 | Mitsubishi Electric Corp | Frame for resin molded semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5022876A (en) * | 1973-06-29 | 1975-03-11 |
-
1978
- 1978-08-15 JP JP9970878A patent/JPS5526672A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5022876A (en) * | 1973-06-29 | 1975-03-11 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4482915A (en) * | 1981-07-06 | 1984-11-13 | Matsushita Electronics Corp. | Lead frame for plastic encapsulated semiconductor device |
| JPS62122254A (en) * | 1985-11-22 | 1987-06-03 | Mitsubishi Electric Corp | Frame for resin molded semiconductor device |
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