JPS5524720A - Solder for hard-to-solder material - Google Patents

Solder for hard-to-solder material

Info

Publication number
JPS5524720A
JPS5524720A JP9664978A JP9664978A JPS5524720A JP S5524720 A JPS5524720 A JP S5524720A JP 9664978 A JP9664978 A JP 9664978A JP 9664978 A JP9664978 A JP 9664978A JP S5524720 A JPS5524720 A JP S5524720A
Authority
JP
Japan
Prior art keywords
solder
rare earth
earth metal
glass
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9664978A
Other languages
Japanese (ja)
Inventor
Mikio Takehara
Koji Nomaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP9664978A priority Critical patent/JPS5524720A/en
Publication of JPS5524720A publication Critical patent/JPS5524720A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE:To provide a solder essentially composed of Pb, Sn, Zn and/or rare earth metal and In and/or Bi with a specifieb blending which enables the bonding of hard-to-solder material such as glass at a low temperature. CONSTITUTION:This solder is composed of 1-97.5% Pb by weight, preferably 80-95%, 1-97.5% Mn, preferably 5-30%, 0.05-15% Zn, and/or 0.01-15% rare earth metal, 0.1-50% In and/or 0.01-60% Bi as essential components. This rare earth metal preferably employs so-called cesium mesh metal composed of 86.8% Ce, 3;0% La, 4.0% Nd, and 6.2% Sm and Pr and impurities from an economical point of view. Slight addition of more than one kinds of Al, Si, Ti and Be can prevent tarnish on the surface of the solder. This solder is applicable to metal, crystalized glass alumina and the like besides glass.
JP9664978A 1978-08-10 1978-08-10 Solder for hard-to-solder material Pending JPS5524720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9664978A JPS5524720A (en) 1978-08-10 1978-08-10 Solder for hard-to-solder material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9664978A JPS5524720A (en) 1978-08-10 1978-08-10 Solder for hard-to-solder material

Publications (1)

Publication Number Publication Date
JPS5524720A true JPS5524720A (en) 1980-02-22

Family

ID=14170667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9664978A Pending JPS5524720A (en) 1978-08-10 1978-08-10 Solder for hard-to-solder material

Country Status (1)

Country Link
JP (1) JPS5524720A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01237095A (en) * 1988-03-17 1989-09-21 Taiho Kogyo Co Ltd Soldering flux
JPH0332487A (en) * 1989-06-28 1991-02-13 Toyota Motor Corp Soldering material
JPH071178A (en) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> Three component solder
WO1995034401A1 (en) * 1994-06-13 1995-12-21 Nihon Almit Co., Ltd. High-strength solder alloy
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
US5871690A (en) * 1997-09-29 1999-02-16 Ford Motor Company Low-temperature solder compositions
CN1052674C (en) * 1995-09-27 2000-05-24 中国科学院金属研究所 Tin-base active flux for soldering ceramic under coarse vacuum condition
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
DE10237495A1 (en) * 2002-04-22 2003-11-13 Siemens Ag Solder material used in the production of electrical/electronic components using Flip-Chip technology contains aluminum
WO2015121939A1 (en) * 2014-02-13 2015-08-20 三菱電機株式会社 Ozone generating apparatus

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01237095A (en) * 1988-03-17 1989-09-21 Taiho Kogyo Co Ltd Soldering flux
JPH0332487A (en) * 1989-06-28 1991-02-13 Toyota Motor Corp Soldering material
JPH071178A (en) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> Three component solder
WO1995034401A1 (en) * 1994-06-13 1995-12-21 Nihon Almit Co., Ltd. High-strength solder alloy
CN1052674C (en) * 1995-09-27 2000-05-24 中国科学院金属研究所 Tin-base active flux for soldering ceramic under coarse vacuum condition
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
US5871690A (en) * 1997-09-29 1999-02-16 Ford Motor Company Low-temperature solder compositions
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
DE10237495A1 (en) * 2002-04-22 2003-11-13 Siemens Ag Solder material used in the production of electrical/electronic components using Flip-Chip technology contains aluminum
WO2015121939A1 (en) * 2014-02-13 2015-08-20 三菱電機株式会社 Ozone generating apparatus
JP6067152B2 (en) * 2014-02-13 2017-01-25 三菱電機株式会社 Ozone generator

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