JPS5524453A - Power supply and heat radiation construction for integrated circuit - Google Patents

Power supply and heat radiation construction for integrated circuit

Info

Publication number
JPS5524453A
JPS5524453A JP9706478A JP9706478A JPS5524453A JP S5524453 A JPS5524453 A JP S5524453A JP 9706478 A JP9706478 A JP 9706478A JP 9706478 A JP9706478 A JP 9706478A JP S5524453 A JPS5524453 A JP S5524453A
Authority
JP
Japan
Prior art keywords
conductor plates
power supply
construction
integrated circuit
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9706478A
Other languages
Japanese (ja)
Inventor
Hiroshi Ihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9706478A priority Critical patent/JPS5524453A/en
Publication of JPS5524453A publication Critical patent/JPS5524453A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To commonly use the metallic conductor plates of heat radiating and power supply systems for reducing in size the construction of high-density IC fittings.
CONSTITUTION: Heat radiating metallic conductor plates 3a and 3b are provided in close contact with the reverse side of an IC 1 mounting circuit substrate 2. Power source current is supplied through said conductor plates 3a and 3b. The heat generated on the supply of said power source current is transferred to said conductor plates 3a and 3b through said substrate 2, and the most thereof is radiated into air. Therefore, said conductor plates 2a and 3b serve not only as heat radiating plates but also as power source current supply circuits. Consequently, the construction of high-density IC fittings can be reduced in size.
COPYRIGHT: (C)1980,JPO&Japio
JP9706478A 1978-08-08 1978-08-08 Power supply and heat radiation construction for integrated circuit Pending JPS5524453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9706478A JPS5524453A (en) 1978-08-08 1978-08-08 Power supply and heat radiation construction for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9706478A JPS5524453A (en) 1978-08-08 1978-08-08 Power supply and heat radiation construction for integrated circuit

Publications (1)

Publication Number Publication Date
JPS5524453A true JPS5524453A (en) 1980-02-21

Family

ID=14182209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9706478A Pending JPS5524453A (en) 1978-08-08 1978-08-08 Power supply and heat radiation construction for integrated circuit

Country Status (1)

Country Link
JP (1) JPS5524453A (en)

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