JPS5522850A - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor deviceInfo
- Publication number
- JPS5522850A JPS5522850A JP9581878A JP9581878A JPS5522850A JP S5522850 A JPS5522850 A JP S5522850A JP 9581878 A JP9581878 A JP 9581878A JP 9581878 A JP9581878 A JP 9581878A JP S5522850 A JPS5522850 A JP S5522850A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- wafer
- cut
- bevel
- jetting port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To establish a cutting efficiently and raise a yield to a resistence to voltage by permitting the longitudinal direction of nozzle jetting port to cross a tangent of a bevel circumference with an angle less than 90 degrees to be cut preferably.
CONSTITUTION: For example, a powder is jetted from a nozzle by revolving a semiconductor wafer 10 having a pnpn construction, a slot is provided in an element to divide the construction into an element body and protection member. An angle making of the surface of the wafer 10 to the nozzle direction is set so that the junction between the cut slot portion and base layer is cut to have some inclination to the bevel. In cutting that, the nozzle has a slit-like jetting port 28, the longitudinal length of the jetting port 68 is crossed an angle less than 90 degrees to a tangent of the circumference of the bevel, for example, at an angle of 45 degree by revolving the wafer 10. Thus, the wafer 10 is efficiently cut down by a one-time processing and a yield of the resistance to voltage.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9581878A JPS5522850A (en) | 1978-08-08 | 1978-08-08 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9581878A JPS5522850A (en) | 1978-08-08 | 1978-08-08 | Manufacturing method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5522850A true JPS5522850A (en) | 1980-02-18 |
Family
ID=14147991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9581878A Pending JPS5522850A (en) | 1978-08-08 | 1978-08-08 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5522850A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724027A (en) * | 1980-07-16 | 1982-02-08 | Tdk Corp | Magnetic recording medium |
| JPH01198073A (en) * | 1988-02-03 | 1989-08-09 | Nippon Inter Electronics Corp | Manufacture of semiconductor device |
-
1978
- 1978-08-08 JP JP9581878A patent/JPS5522850A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724027A (en) * | 1980-07-16 | 1982-02-08 | Tdk Corp | Magnetic recording medium |
| JPH01198073A (en) * | 1988-02-03 | 1989-08-09 | Nippon Inter Electronics Corp | Manufacture of semiconductor device |
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