JPS5516433A - Method of forming multilayer distributing layer - Google Patents

Method of forming multilayer distributing layer

Info

Publication number
JPS5516433A
JPS5516433A JP8924078A JP8924078A JPS5516433A JP S5516433 A JPS5516433 A JP S5516433A JP 8924078 A JP8924078 A JP 8924078A JP 8924078 A JP8924078 A JP 8924078A JP S5516433 A JPS5516433 A JP S5516433A
Authority
JP
Japan
Prior art keywords
layer
throughholes
membrane
distributing
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8924078A
Other languages
Japanese (ja)
Inventor
Yoshio Takahashi
Yoshimasa Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8924078A priority Critical patent/JPS5516433A/en
Publication of JPS5516433A publication Critical patent/JPS5516433A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To make needless of etching to form throughholes by removing hotresist membrane after attaching hotresisting membrane over the area for forming throughholes of a distributing layer and laminating the layer insulators by means of anodic oxidation of the distributing layer surface.
CONSTITUTION: To attach hotresist membrane 15 over the area for forming the prescribed throughholes of the distributing area 11 which is formed on the base 12 using the metal such as Al etc. capable of anodic oxidation, and then to perform anodic oxidation 13 of the surface of the distributing layer 11. Next, after forming by lamination a layer insulating layer such as a silicon oxide layer etc. made by a spattering method, the hot resist membrane 15 will be removed with resist stripping fluid to form the required throughholes 17. By doing so, there is no need of etching with hydrofluoric etching fluid for forming throughholes, a damage of distributing pattern as well as the generation of oxidised membrane will be prevented to provide multilayer distributing layer of high quality.
COPYRIGHT: (C)1980,JPO&Japio
JP8924078A 1978-07-21 1978-07-21 Method of forming multilayer distributing layer Pending JPS5516433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8924078A JPS5516433A (en) 1978-07-21 1978-07-21 Method of forming multilayer distributing layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8924078A JPS5516433A (en) 1978-07-21 1978-07-21 Method of forming multilayer distributing layer

Publications (1)

Publication Number Publication Date
JPS5516433A true JPS5516433A (en) 1980-02-05

Family

ID=13965211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8924078A Pending JPS5516433A (en) 1978-07-21 1978-07-21 Method of forming multilayer distributing layer

Country Status (1)

Country Link
JP (1) JPS5516433A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214143A (en) * 1989-02-15 1990-08-27 Hitachi Ltd Thin-film electronic circuit
JPH11354797A (en) * 1999-06-02 1999-12-24 Semiconductor Energy Lab Co Ltd Mis type semiconductor device and its manufacture
US6417543B1 (en) 1993-01-18 2002-07-09 Semiconductor Energy Laboratory Co., Ltd. MIS semiconductor device with sloped gate, source, and drain regions
JP2008122317A (en) * 2006-11-15 2008-05-29 Tokyo Keiso Co Ltd Ultrasonic flow meter for gas

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02214143A (en) * 1989-02-15 1990-08-27 Hitachi Ltd Thin-film electronic circuit
US6417543B1 (en) 1993-01-18 2002-07-09 Semiconductor Energy Laboratory Co., Ltd. MIS semiconductor device with sloped gate, source, and drain regions
US6984551B2 (en) 1993-01-18 2006-01-10 Semiconductor Energy Laboratory Co., Ltd. MIS semiconductor device and method of fabricating the same
US7351624B2 (en) 1993-01-18 2008-04-01 Semiconductor Energy Laboratory Co., Ltd. MIS semiconductor device and method of fabricating the same
JPH11354797A (en) * 1999-06-02 1999-12-24 Semiconductor Energy Lab Co Ltd Mis type semiconductor device and its manufacture
JP2008122317A (en) * 2006-11-15 2008-05-29 Tokyo Keiso Co Ltd Ultrasonic flow meter for gas

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