JPS55156693A - Soft braze material - Google Patents

Soft braze material

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Publication number
JPS55156693A
JPS55156693A JP6419379A JP6419379A JPS55156693A JP S55156693 A JPS55156693 A JP S55156693A JP 6419379 A JP6419379 A JP 6419379A JP 6419379 A JP6419379 A JP 6419379A JP S55156693 A JPS55156693 A JP S55156693A
Authority
JP
Japan
Prior art keywords
000ppm
less
bonding property
amount
braze material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6419379A
Other languages
Japanese (ja)
Inventor
Kisaku Nakamura
Tetsuo Saito
Norio Ozawa
Yoshinori Honma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6419379A priority Critical patent/JPS55156693A/en
Publication of JPS55156693A publication Critical patent/JPS55156693A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To improve bonding property and oxidation resistance by adding the specific amount or less of Ga or In alone or both to the base soft braze material composed primarily of Pb or Sn and further letting the specific amount of P coexist.
CONSTITUTION: Ga 4,000ppm or In 5,000ppm or less are added alone or both to the base soft braze material of Pb-Sn alloy or Pb-Sn-Ag alloy and further P is let to exist at 10W200ppm. It is because above the specified amount the improvement in bonding property cannot be achieved despite the coexistence of P that the addition amounts of Ga and In are limited to the above. Prticularly it is desirable to add 60W400ppm of Ga and 300W5,000ppm of In. When both are to be added, the amount is made 5,000ppm or less. At 10ppm or less of the coexistence amount of P, the bonding property cannot be improved and at 120ppm or more, the degradation in spreading rate and the hindrance of bonding property occur.
COPYRIGHT: (C)1980,JPO&Japio
JP6419379A 1979-05-24 1979-05-24 Soft braze material Pending JPS55156693A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6419379A JPS55156693A (en) 1979-05-24 1979-05-24 Soft braze material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6419379A JPS55156693A (en) 1979-05-24 1979-05-24 Soft braze material

Publications (1)

Publication Number Publication Date
JPS55156693A true JPS55156693A (en) 1980-12-05

Family

ID=13250978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6419379A Pending JPS55156693A (en) 1979-05-24 1979-05-24 Soft braze material

Country Status (1)

Country Link
JP (1) JPS55156693A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819455A (en) * 1981-07-24 1983-02-04 Nippon Fuiraa Metal:Kk Preventing method for oxidation of molten lead, tin or tin-lead alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819455A (en) * 1981-07-24 1983-02-04 Nippon Fuiraa Metal:Kk Preventing method for oxidation of molten lead, tin or tin-lead alloy

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