JPS55154580A - Copper etching bath - Google Patents

Copper etching bath

Info

Publication number
JPS55154580A
JPS55154580A JP6218879A JP6218879A JPS55154580A JP S55154580 A JPS55154580 A JP S55154580A JP 6218879 A JP6218879 A JP 6218879A JP 6218879 A JP6218879 A JP 6218879A JP S55154580 A JPS55154580 A JP S55154580A
Authority
JP
Japan
Prior art keywords
etching bath
bath
etching
copper etching
salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6218879A
Other languages
Japanese (ja)
Inventor
Noriaki Tsukada
Kunio Okamoto
Kaoru Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamatoya and Co Ltd
Original Assignee
Yamatoya and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatoya and Co Ltd filed Critical Yamatoya and Co Ltd
Priority to JP6218879A priority Critical patent/JPS55154580A/en
Publication of JPS55154580A publication Critical patent/JPS55154580A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To increase the etching speed of a Cu etching bath by adding nitrobenzenesulfonic acid or a salt thereof. CONSTITUTION:Nitrobenzenesulfonic acid or a salt thereof as an accelerator is added to an well-known Cu etching bath to prepare an etching bath. For example, 0.5% of sodium m-nitrobenzenesulfonate is added to an ammonia alkaline Cu etching bath contg. cupric chloride, ammonium hydroxide and ammonium chloride. Thus, the etching speed of the bath can be increased remarkably.
JP6218879A 1979-05-22 1979-05-22 Copper etching bath Pending JPS55154580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6218879A JPS55154580A (en) 1979-05-22 1979-05-22 Copper etching bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6218879A JPS55154580A (en) 1979-05-22 1979-05-22 Copper etching bath

Publications (1)

Publication Number Publication Date
JPS55154580A true JPS55154580A (en) 1980-12-02

Family

ID=13192906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6218879A Pending JPS55154580A (en) 1979-05-22 1979-05-22 Copper etching bath

Country Status (1)

Country Link
JP (1) JPS55154580A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0349600A1 (en) * 1987-12-29 1990-01-10 Macdermid Inc Improved copper etchant compositions.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115752A (en) * 1976-01-05 1977-09-28 Shipley Co Etching liquid

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115752A (en) * 1976-01-05 1977-09-28 Shipley Co Etching liquid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0349600A1 (en) * 1987-12-29 1990-01-10 Macdermid Inc Improved copper etchant compositions.

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