JPS55154564U - - Google Patents
Info
- Publication number
- JPS55154564U JPS55154564U JP5537379U JP5537379U JPS55154564U JP S55154564 U JPS55154564 U JP S55154564U JP 5537379 U JP5537379 U JP 5537379U JP 5537379 U JP5537379 U JP 5537379U JP S55154564 U JPS55154564 U JP S55154564U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5537379U JPS603587Y2 (ja) | 1979-04-24 | 1979-04-24 | 発光ダイオ−ド基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5537379U JPS603587Y2 (ja) | 1979-04-24 | 1979-04-24 | 発光ダイオ−ド基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55154564U true JPS55154564U (de) | 1980-11-07 |
JPS603587Y2 JPS603587Y2 (ja) | 1985-01-31 |
Family
ID=28951129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5537379U Expired JPS603587Y2 (ja) | 1979-04-24 | 1979-04-24 | 発光ダイオ−ド基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS603587Y2 (de) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62235787A (ja) * | 1986-04-07 | 1987-10-15 | Koito Mfg Co Ltd | 照明装置 |
JPS63101987U (de) * | 1986-12-22 | 1988-07-02 | ||
JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2006517738A (ja) * | 2003-02-07 | 2006-07-27 | 松下電器産業株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
WO2011078010A1 (ja) | 2009-12-25 | 2011-06-30 | 富士フイルム株式会社 | 絶縁基板、絶縁基板の製造方法、配線の形成方法、配線基板および発光素子 |
EP2384100A2 (de) | 2010-04-28 | 2011-11-02 | Fujifilm Corporation | Isoliertes lichtreflektierndes Substrat |
EP2420869A2 (de) | 2010-08-16 | 2012-02-22 | Fujifilm Corporation | Rückstrahlungsplatte für eine LED |
-
1979
- 1979-04-24 JP JP5537379U patent/JPS603587Y2/ja not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62235787A (ja) * | 1986-04-07 | 1987-10-15 | Koito Mfg Co Ltd | 照明装置 |
JPS63101987U (de) * | 1986-12-22 | 1988-07-02 | ||
JP2006517738A (ja) * | 2003-02-07 | 2006-07-27 | 松下電器産業株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
WO2011078010A1 (ja) | 2009-12-25 | 2011-06-30 | 富士フイルム株式会社 | 絶縁基板、絶縁基板の製造方法、配線の形成方法、配線基板および発光素子 |
EP2384100A2 (de) | 2010-04-28 | 2011-11-02 | Fujifilm Corporation | Isoliertes lichtreflektierndes Substrat |
EP2420869A2 (de) | 2010-08-16 | 2012-02-22 | Fujifilm Corporation | Rückstrahlungsplatte für eine LED |
Also Published As
Publication number | Publication date |
---|---|
JPS603587Y2 (ja) | 1985-01-31 |