JPS5515085A - Inspection method of semiconductor element - Google Patents
Inspection method of semiconductor elementInfo
- Publication number
- JPS5515085A JPS5515085A JP8876378A JP8876378A JPS5515085A JP S5515085 A JPS5515085 A JP S5515085A JP 8876378 A JP8876378 A JP 8876378A JP 8876378 A JP8876378 A JP 8876378A JP S5515085 A JPS5515085 A JP S5515085A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead
- defective
- mechanical durability
- decided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
PURPOSE: To grasp a mechanical durability in a short time and improve reliability by detecting the mechanical durability under a state where a thermal gradient stress is applied to a lead mount-type semiconductor element.
CONSTITUTION: One of lead electrodes 4 and 5 of a lead mount-type semiconductor element is made high temeperature-state, and the other is cooled, and a thermal gradient stress is applied across electrodes 4 and 5. Consequently, stress is applied to pellet 1 and across lead electrodes 4 and 5 due to differece in thermal expansion coefficient between pellet 1 and lead electeodes 4 and 5. In case of small mechanical durability, pellet 1 and lead electrodes 4 and 5 generate cut, crack and pellet break and are decided as charrrrcteristic defective. In case of strong mechanical durability, adhesion face slippage, etc., are generated among pellet 1 and lead electrodes 4 and 5, and contact resistance 6 of the equivalent circuit of a diode is increased, and they are decided as forward voltage defective. However, crack of resin part 3 is decided as appearance defective and characteristic defective.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8876378A JPS5515085A (en) | 1978-07-19 | 1978-07-19 | Inspection method of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8876378A JPS5515085A (en) | 1978-07-19 | 1978-07-19 | Inspection method of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5515085A true JPS5515085A (en) | 1980-02-01 |
Family
ID=13951903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8876378A Pending JPS5515085A (en) | 1978-07-19 | 1978-07-19 | Inspection method of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5515085A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833061A (en) * | 2010-06-06 | 2010-09-15 | 工业和信息化部电子第五研究所 | Method and device for testing tensile strength of axial lead of glass shell diode |
| CN101949799A (en) * | 2010-08-17 | 2011-01-19 | 徐州整流汽车元件有限公司 | Rectifier diode contact tension test desk for automobile power generator |
| CN108489821A (en) * | 2018-02-28 | 2018-09-04 | 中国空间技术研究院 | A kind of device for axial lead tensile test |
-
1978
- 1978-07-19 JP JP8876378A patent/JPS5515085A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833061A (en) * | 2010-06-06 | 2010-09-15 | 工业和信息化部电子第五研究所 | Method and device for testing tensile strength of axial lead of glass shell diode |
| CN101949799A (en) * | 2010-08-17 | 2011-01-19 | 徐州整流汽车元件有限公司 | Rectifier diode contact tension test desk for automobile power generator |
| CN108489821A (en) * | 2018-02-28 | 2018-09-04 | 中国空间技术研究院 | A kind of device for axial lead tensile test |
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